| HS Code | 446616 |
| Vinyl Acetate Content | 28% |
| Melt Index 190 C 2 16 Kg | 25 g/10 min |
| Density | 0.950 g/cm³ |
| Melting Point Dsc | 78 °C |
| Glass Transition Temperature | -30 °C |
| Vicat Softening Point | 45 °C |
| Tensile Strength At Break | 10 MPa |
| Elongation At Break | 800% |
| Hardness Shore A | 84 |
| Flexural Modulus | 28 MPa |
| Brittleness Temperature | -70 °C |
| Ring And Ball Softening Point | 85 °C |
As an accredited Ateva 2821A EVA Copolymer Resin,28% VA,25 MI,Hot Melt Adhesive Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaged as 25 kg polyethylene bags, palletized with 40 bags per pallet (1,000 kg total) for safe handling and storage. |
| Container Loading (20′ FCL) | 20′ FCL of Ateva 2821A EVA resin, 28% VA, 25 MI, hot melt grade, loaded as 25 kg bags on pallets, secured and ventilated. |
| Shipping | Ateva 2821A EVA resin ships as free-flowing pellets in moisture-resistant bags on pallets. Keep dry, protected from direct sunlight, and away from high heat during transport. Ensure secure strapping to prevent bag damage. No special hazardous designation; standard dry freight handling applies. |
| Storage | Store Ateva 2821A EVA copolymer resin in a cool, dry, well-ventilated area, away from direct sunlight, heat, and ignition sources. Keep containers tightly sealed to prevent moisture pickup and contamination. Maintain moderate temperatures; avoid excessive heat or humidity. Follow FIFO rotation to ensure product stability and preserve hot-melt adhesive performance. |
| Shelf Life | Store in a cool, dry area away from heat and sunlight. Shelf life is typically one year from shipment. |
Corrugated case sealing lines operating at 60–120 cases/min are a primary downstream target for Ateva 2821A because the 28% VA content develops rapid specific adhesion to semichemical fluting, clay-coated liner, and recycled board, while the 25 MI melt index permits transfer through 200 kg drum unloaders and gear pumps without excessive back-pressure. The compliance anchor is FDA 21 CFR 175.105 for indirect food-contact adhesives, supplemented by EU 1935/2004/EC for general food-contact framework review and REACH EC 1907/2006 for registration; heat resistance is screened by ASTM D4498, and melt viscosity is controlled under ASTM D3236 at 160°C. Typical packaging hot-melt formulation addition is 30–35 wt% Ateva 2821A, 35–40 wt% rosin ester tackifier with 85–95°C ring-and-ball softening point, 15–20 wt% paraffin wax of 58–62°C congealing point, and 0.5–1.0 wt% hindered phenolic antioxidant. In downstream production, the molten compound is applied through slot-die nozzles at 150–170°C to the minor flap, compression is held for 0.5–1.0 s, and set time is below 1 s; cold pop-off failure is observed when board stock temperature falls below 5°C unless add-on is increased from 0.10 mm to 0.18 mm bead diameter. Terminal product types include regular slotted containers, die-cut wraparound trays, multi-wall paper sacks, and paperboard beverage carriage cartons.
When a perfect binder accelerates past 8,000 cycles/h, the backbone adhesive must retain sufficient low-rate extensibility to prevent spine cracking during cover opening, and the 28% vinyl acetate content of Ateva 2821A is selected because it lowers glass-transition behaviour relative to lower-VA EVA grades while maintaining compatibility with rosin ester tackifiers. Compliance in bookbinding applications is not governed by a single adhesive standard; production specifications commonly reference ISO 1924-2 for paper tensile integrity, ASTM D1876 for T-peel resistance of spine-to-cover bonds, and ASTM D3236 for Brookfield viscosity at 160°C. The formulation addition ratio is 40–45 wt% Ateva 2821A, 35–40 wt% rosin ester tackifier with 80–90°C softening point, 5–10 wt% microcrystalline wax, and 0.5–1.0 wt% hindered phenolic antioxidant; no filler is introduced because filler above 5 wt% reduces page-pull strength below QC limits on coated text paper. The downstream process uses Muller Martini or Kolbus perfect binders with backbone pots at 150–165°C, side-glue pots at 140–155°C, roughened signatures, adhesive film thickness of 0.3–0.6 mm, cover nipping, and cooling tunnel air at 5–15°C for 6–12 s before three-knife trimming. Terminal product types include perfect-bound softcover books, catalogues, annual reports, technical manuals, and notepads.
In MDF edge banding cells running 15–25 m/min, the adhesive must wet thin PVC, ABS, PP, or polyester edging tape and carry filler without phase separation across a 180–200°C premelt residence time. Industry compliance commonly references EN 204 Class D2/D3 for non-structural thermoplastic wood adhesives and ASTM D905 compression shear strength on edge-banded wood joints; melt consistency is checked by ASTM D3236 at 180°C, and softening point is determined by ASTM E28. The formulation addition ratio for edge banding is 25–35 wt% Ateva 2821A, 30–40 wt% C5/C9 hydrocarbon resin tackifier, 20–30 wt% calcium carbonate filler of 2–5 µm median particle size, 2–5 wt% paraffin wax, and 0.5–1.0 wt% hindered phenolic antioxidant. Downstream production uses Homag or Biesse edge banding machines with granulate feed, heated roller application at 180–200°C, pressure-zone rollers set to 0.2–0.4 MPa, end trimming, and radius scraping; open time is 1.5–3.0 s, and the bond is classified as set below 1 s after contact pressure. Terminal product types include desktops, cabinet doors, office partitions, shelving components, and drawer panels; operational limitation is that continuous service temperature above 60°C should be avoided because creep deformation may occur.
Profile wrapping lines processing low-density MDF or particleboard cores require a hot melt that can fill surface irregularities without excessive penetration, and Ateva 2821A at 25 MI provides moderate open time for foil or veneer wrapping before the calibrating rollers set the laminate. Relevant compliance includes ISO 1133-1:2022 for melt flow rate verification, ASTM D3418 for DSC transition profiling, and REACH EC 1907/2006 for substance registration; if the wrapped profile enters furniture markets, formaldehyde emission requirements are controlled at the board level rather than the adhesive layer. The formulation addition ratio is 20–30 wt% Ateva 2821A, 35–45 wt% rosin ester or modified rosin tackifier, 10–20 wt% calcium carbonate filler, 5–10 wt% microcrystalline wax, and 0.5–1.0 wt% hindered phenolic antioxidant. In downstream production, the hot melt is applied by roller or slot coater at 160–180°C onto profiles travelling at 10–40 m/min; substrate moisture content must remain between 6% and 10%, because moisture above 10% generates steam blow-off at the hot-melt interface and produces visible delamination. Terminal product types include furniture edge profiles, skirting boards, picture frame mouldings, door frame claddings, and MDF decorative strips.
Because pleated filter production requires high initial tack on polar media and adhesion to polyurethane or epoxy-coated end caps, Ateva 2821A is formulated at 30–35 wt% loading with 40–45 wt% rosin ester tackifier, 10–20 wt% aliphatic hydrocarbon resin, and 0.5–1.0 wt% hindered phenolic antioxidant to balance open time and sag resistance. Compliance is driven by REACH EC 1907/2006 and, where filters contact potable air or water systems, additional review against local food-contact or drinking-water directives may be required; process control is anchored to ASTM D3236 for viscosity at 150°C and ASTM D4498 for heat-fail temperature. The downstream production step uses gear-pump delivery through a heated hose to a nozzle or slot applicator at 140–160°C, placing adhesive on pleat tips or end-cap channels; open time is 3–8 s, and the assembly is cooled to ambient within 30 s before pleat expansion. Terminal product types include pleated panel filters, cabin air filters, vacuum cleaner bags, and humidifier wick assemblies; continuous service temperature should not exceed 65°C because heat-fail resistance declines sharply at higher thermal load.
Under low-stress electrical component fixation conditions, Ateva 2821A is used as a hot-melt assembly adhesive for wire tackling and small plastic component location where mechanical fasteners are not feasible; the 28% VA content contributes to adhesion on polar plastics such as ABS and rigid PVC, while the 25 MI allows application through pneumatic or hand-held dispensing units without nitrogen blanketing. Compliance references include IEC 60335-1 for household appliance safety, UL 746C for polymeric material evaluation in electrical equipment where specified, and REACH EC 1907/2006 for EU market access. The formulation addition ratio is 25–30 wt% Ateva 2821A, 35–45 wt% hydrogenated hydrocarbon tackifier, 10–20 wt% wax blend of paraffin and microcrystalline wax, and 0.5–1.0 wt% hindered phenolic antioxidant. In production, molten adhesive is applied at 140–160°C by pneumatic dispensing guns with open time between 10 s and 30 s, fixture time of 5–15 s, and final strength achieved after cooling to 25°C within 60 s; untreated PE or PP substrates require corona or plasma pretreatment to prevent adhesive failure at the interface. Terminal product types include internal appliance wiring harnesses, control panel cable anchors, refrigerator door switch assemblies, and small window air-conditioning unit component fixation; published data for Ateva 2821A in this specific electrical assembly configuration is limited.
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Ateva 2821A, produced by Celanese, is an ethylene-vinyl acetate copolymer resin designated for hot melt adhesive formulation. The material is specified with a vinyl acetate comonomer content of 28 wt% and a melt flow rate of 25 g/10 min when measured in accordance with ASTM D1238 at 190 °C under a 2.16 kg load. The resin is supplied in pellet form. Published typical density is 0.951 g/cm³ per ASTM D1505. Manufacturer-published typical values include a DSC melting peak near 73 °C, a Vicat softening temperature of 54 °C under ASTM D1525, Shore A hardness of 76 per ASTM D2240, tensile strength at break of 10 MPa, and elongation at break of 780% per ASTM D638. These values position Ateva 2821A as a low-melting EVA with sufficient melt flow for high-speed hot melt application equipment while retaining polar substrate adhesion and low-temperature flexibility.
| Property | Test method | Published typical value | Application relevance |
|---|---|---|---|
| Vinyl acetate content | Manufacturer specification | 28 wt% | Polar adhesion and flexibility control |
| Melt flow rate | ASTM D1238, 190 °C, 2.16 kg | 25 g/10 min | Melt viscosity and wetting speed |
| Density | ASTM D1505 | 0.951 g/cm³ | Coverage and yield calculations |
| DSC melting peak | DSC, second heat | 73 °C | Initial melt temperature setting |
| Vicat softening point | ASTM D1525 | 54 °C | Heat resistance screening |
| Shore A hardness | ASTM D2240 | 76 | Cooled adhesive flexibility |
| Tensile strength at break | ASTM D638 | 10 MPa | Cohesive strength screening |
| Elongation at break | ASTM D638 | 780% | Ductility and toughness estimate |
The comonomer content controls the balance between crystalline polyethylene-like segments and amorphous vinyl acetate-rich domains. At 28 wt% VA, crystallinity is reduced relative to EVA grades containing 18 wt% VA, lowering the melting point and increasing the concentration of polar acetate groups. The acetate group contributes dipole interactions and hydrogen-bond acceptance with cellulosic, starch-based, and hydroxyl-functional surfaces. In contrast, low-VA EVA copolymers exhibit higher crystallinity and a sharper melting endotherm, which reduces wetting of porous paper and board at equivalent application temperatures. The higher VA content also imparts low-temperature flexibility and lowers flexural modulus. Published flexible packaging laminate data for this specific grade is limited; however, the effect of VA content on surface energy and peel adhesion is documented in standard adhesive test matrices using ASTM D1876 and related methods. At 28 wt% VA, modulus and hardness are lower than those of 18 wt% VA grades, while cohesive strength is lower than that of semicrystalline EVA with longer polyethylene sequence length. This trade-off favors adhesion to paper, carton board, wood, and textile fibers over elevated-temperature resistance. The resin is therefore selected when the adhesive must wet polar substrates rapidly and retain flexibility at refrigeration temperatures near 0 °C to 5 °C.
In packaging hot melt applications, Ateva 2821A is typically compounded with hydrocarbon tackifiers, rosin ester tackifiers, waxes, and antioxidants. The formulation is melted in a bulk melter and delivered through a gear pump to a slot-die coater, roller coater, or multi-nozzle jet application head. The melt flow rate of 25 g/10 min supports lower system viscosity than lower-MI grades, reducing shear heating in the gear pump and improving adhesive transfer at line speeds above 60 m/min. Process temperatures for the formulation are generally held between 160 °C and 180 °C. Prolonged exposure above 200 °C accelerates EVA degradation and acetic acid evolution. Industrial compounding records indicate that when viscosity is too low, adhesive may penetrate excessively into folding carton stock, reducing fiber-tearing bond area. When viscosity is too high, open time shortens and wetting of board becomes incomplete. Ateva 2821A occupies an intermediate melt-flow position that permits adjustment of open time and set speed through wax and tackifier ratio rather than through a change in base resin grade.
Hot melt adhesive production using Ateva 2821A is generally performed in twin-screw extruders with L/D ratios between 40:1 and 64:1. The resin is fed into the first barrel section; tackifier and wax may be added downstream through side feeders to limit thermal history. Published capillary rheometry data for EVA resins with comparable VA content indicate shear-thinning behavior with viscosity in the range of 1–5 Pa·s at 180 °C and shear rates above 100 s⁻¹. Exact viscosity values for Ateva 2821A must be confirmed by ASTM D3835 because melt temperature and shear rate interact with VA content. The 25 g/10 min melt flow rate permits lower extrusion head pressure than a 10 g/10 min grade of equivalent VA content. The resin therefore facilitates thin coating weight control in slot-die systems at target coat weights of 100–300 g/m² without excessive die lip temperatures. Barrel set points are commonly segmented from 120 °C at the feed throat to 160–170 °C at the discharge zone. Increasing discharge temperature above 190 °C may produce gel particles and discoloration. The material should be dried at 60 °C for 4 h when storage relative humidity exceeds 60% to minimize moisture-related foaming in the die. Batch-to-batch variation of melt flow rate for EVA resin is generally controlled within ±10% of nominal; incoming lot testing by ASTM D1238 is recommended before large-scale adhesive blending.
Bookbinding adhesives based on Ateva 2821A have been formulated for perfect binding lines where the adhesive must penetrate spine folds and maintain page-pull strength. Because the resin contains 28 wt% VA, it remains flexible after cooling to ambient conditions; this reduces page crack at low storage temperatures compared with lower-VA EVA grades. Published data for this specific configuration is limited, but laboratory testing on spine adhesion often follows ASTM D1876 or internal tensile pull methods. The resin is normally combined with rosin ester tackifier and a paraffin or Fischer-Tropsch wax to control set time. In side gluing, where minimal adhesive penetration is required, the melt flow rate of 25 g/10 min may be too high for very porous papers. Formulators can compensate by increasing wax loading or adding a small percentage of a lower-MI EVA to raise viscosity.
Ateva 2821A shows broad compatibility with rosin ester tackifiers and C5/C9 hydrocarbon resins, but phase separation can occur with highly aliphatic or very high-softening-point resins. The clarity of a compression-molded or coated adhesive film is used as a rapid compatibility check; persistent haze after aging at 130 °C for 24 h may indicate incompatibility. Compatibility limits are also influenced by the wax component. Fischer-Tropsch waxes with congealing points above 100 °C can reduce open time but increase the risk of brittle failure at −10 °C. Antioxidant packages, typically hindered phenols and phosphite stabilizers at 0.1–1.0 wt%, protect the vinyl acetate units from thermal-oxidative degradation. Compatibility with highly polar plasticizers, chlorinated paraffins, and basic additives should be verified because deacetylation and pH shifts can affect applicator metallurgy and viscosity stability. When used in food-contact packaging, the final adhesive formulation must be evaluated under FDA 21 CFR 175.105 or the applicable regional regulation; the neat resin alone does not confer food-contact compliance without formulation-level verification.
In woodworking edgebanding and profile wrapping, Ateva 2821A is selected when a fast melt and lower application temperature reduce hot-melt char and improve adhesion to PVC edgebanding. The resin is often blended with EVA grades of higher VA content to adjust flexibility on high-pressure laminate edges. Bond strength measured by DIN EN 204 or DIN EN 205 depends primarily on the final formulation, substrate preparation, and pressing parameters; neat resin peel values are not directly transferable to production. On edgebanding lines operating at 20–40 m/min, the melt flow rate of 25 g/10 min supports fast application from roller applicators, but too high a melt temperature reduces heat resistance of the finished bond. Published process data for this specific grade in edgebanding formulations is limited, and full-scale trials are required to establish line-specific set temperatures.
Substitution of a lower-MI EVA with Ateva 2821A alters both melt viscosity and final bond physical properties. A lower-MI grade of comparable VA content may require application temperatures of 180–200 °C; Ateva 2821A often permits reductions of 10–20 °C, reducing thermal degradation and char formation in the melter. However, cohesive strength and heat resistance may decrease because the higher melt index is associated with a lower average molecular weight distribution. In case-sealing adhesives this can lower the fiber tear temperature threshold. After exposure to 60 °C, a formulation based on Ateva 2821A may exhibit lower shear resistance than a 10 g/10 min EVA if the formulation is not rebalanced with higher-softening-point tackifier. Formulators generally compensate by increasing wax congealing point or reducing high-melt-flow diluent content. The material also parallels higher-MI grades in nonwoven construction adhesives where low application viscosity improves spray pattern control, but lower MI grades remain preferred where extended open time or higher green strength is required. In hot melt pressure-sensitive adhesives, Ateva 2821A is typically used as a cohesive strength modifier rather than as the sole polymer; the final balance of loop tack, peel, and shear is established by tackifier selection and test methods such as ASTM D6195, ASTM D3330, and ASTM D3654.
Thermal degradation of ethylene-vinyl acetate copolymers follows deacetylation kinetics that accelerate above 190 °C. At 200 °C, acetic acid liberation can increase substantially with a 10 °C rise. The practical processing window for 28 wt% VA grades is therefore often limited to 160–180 °C; deviations above 180 °C require reduced residence time in the melter, typically below 15 min. In slot-die coating, the combination of high shear and prolonged recirculation can generate gel. Filtration through 100-mesh screens is recommended before the die. Acidic degradation by-products can corrode steel applicator parts; stainless steel or appropriately coated applicator components are preferred for continuous operation. These operational boundaries are specific to formulation and equipment configuration, and published service data for Ateva 2821A in all applicator types is limited.
