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Anhui Liwei Chemical Co., Limited.

LG EVA 28150 EVA Copolymer Resin,28% VA,150 MI,Hot Melt Adhesive Grade

    • Product Name: LG EVA 28150 EVA Copolymer Resin,28% VA,150 MI,Hot Melt Adhesive Grade
    • Factroy Site: Lingwu, Yinchuan, Ningxia, China
    • Price Inquiry: sales2@liwei-chem.com
    • Manufacturer: Anhui Liwei Chemical Co., Limited.
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    Specifications
    HS Code 227651
    Resin Type Ethylene Vinyl Acetate (EVA) Copolymer
    Va Content 28%
    Melt Index 150 g/10 min
    Density 0.950 g/cm³
    Melting Point 70°C
    Softening Point 70°C
    Tensile Strength 6.0 MPa
    Elongation At Break 750%
    Hardness Shore A 70
    Viscosity 5000 cP at 190°C
    Physical Form Pellets
    Application Grade Hot Melt Adhesive

    As an accredited LG EVA 28150 EVA Copolymer Resin,28% VA,150 MI,Hot Melt Adhesive Grade factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Supplied in 25 kg net polyethylene-lined paper bags, palletized and stretch-wrapped for safe handling and moisture protection.
    Container Loading (20′ FCL) 20' FCL loads about 20–25 MT of LG EVA 28150, packed in 25 kg bags on pallets, shrink-wrapped for safe transport.
    Shipping LG EVA 28150 is a thermoplastic resin supplied as free-flowing pellets, typically packaged in 25 kg multi-wall paper bags or supersacks. Ship in dry, clean containers to prevent moisture absorption. Keep away from heat, open flames, and direct sunlight. No hazardous classification for routine transport; handle with standard industrial care.
    Storage Store LG EVA 28150 resin in a cool, dry, well-ventilated area, away from direct sunlight, heat, and ignition sources. Keep containers tightly sealed to prevent moisture pickup, which can affect performance. Maintain ambient temperatures below 30°C; avoid stacking near hot equipment. Proper storage preserves flow properties and ensures consistent hot-melt adhesive performance.
    Shelf Life Shelf life is typically 2 years when stored in a cool, dry place away from direct sunlight and moisture.
    Application of LG EVA 28150 EVA Copolymer Resin,28% VA,150 MI,Hot Melt Adhesive Grade

    On corrugated case sealing lines running at 30–60 cases/min, LG EVA 28150 is compounded as the base resin for low-viscosity hot melt formulations where high-speed slot nozzle or wheel application must wet kraft linerboard, mottled white top liner, and recycled board without smearing. The polymer carries 28% vinyl acetate and a melt flow rate of 150 g/10 min measured at 190 °C/2.16 kg per ISO 1133-1:2022. The high melt index reduces compounded melt viscosity at 150–170 °C, allowing a heated gear pump or piston pump to meter thin beads without excessive back pressure. This property is relevant only when the full formulation is considered; the base resin alone does not set the final adhesive performance. Published data for this specific EVA 28150 commercial case-sealing formulation is limited, but the following starting ranges are consistent with industrial EVA hot melt practice for high-MI grades.

    Representative starting formulation ranges for EVA 28150 in case and carton sealing
    ComponentTypical weight fraction
    EVA 2815030–45 wt%
    C5/C9 hydrocarbon tackifier30–40 wt%
    Paraffin/microcrystalline wax10–20 wt%
    Antioxidant0.3–1.0 wt%

    In production, the adhesive is run through a heated slot nozzle or roller wheel at 150–170 °C. On uncoated kraft linerboard, open time at 160 °C is typically 3–8 s; set time under 0.2–0.5 MPa compression is 0.5–2 s. The bonding requirement is substrate fibre tear rather than adhesive peel, because the corrugated board itself is the failure zone. A process limit is bleed-through on 115–150 g/m² recycled board when melt temperature exceeds 170 °C and bead diameter exceeds 0.5 mm. Nozzle tip temperature should be held within ±5 °C of the pot setpoint to suppress stringing and char formation. For indirect food contact packaging, the compounded adhesive falls under 21 CFR 175.105, and the converter must verify that the final adhesive contains no migratory additives above end-user extraction limits. Finished joints are used in regular slotted cartons, die-cut display trays, and corrugated mailers.

    What Does a 150 g/10 min Melt Flow Rate Change in Perfect Binding Adhesion?

    In perfect binding, a 150 g/10 min melt flow rate changes penetration into spine fibre and the usable open time window. Higher flow permits a lower glue pot temperature, but it also increases the risk of soak-through on short-fibre or uncoated book papers. The 28% vinyl acetate content in EVA 28150 raises polar interaction with cellulose surfaces, which is necessary for maintaining page pull retention after repeated flexing of the paperback spine. The adhesive must be formulated so that the compounded melt penetrates the roughened spine enough to grip the fibres without stiffening the hinge beyond acceptable opening torque.

    A starting formulation for EVA 28150 in bookbinding uses 30–45 wt% EVA, 25–35 wt% rosin ester tackifier, 15–25 wt% paraffin/microcrystalline wax, and 0–5 wt% fumed silica or calcium carbonate. The rosin ester grade should have an acid number below 15 mg KOH/g to reduce ester hydrolysis at processing temperatures above 160 °C. Open time measured on uncoated paper at 160 °C is typically 3–8 s, and set time under nipping pressure is 1–3 s. The wax package controls grab and cold adhesion; excessive wax concentration above 20 wt% reduces low-temperature flexibility and increases the chance of brittle spine cracking in cold storage.

    On a perfect binding line with spine milling and slot application, the adhesive pot temperature is held at 150–170 °C. Spine glue is applied as a 0.3–0.8 mm melt film, while side glue is run at lower viscosity to close the cover joint. Heat resistance is evaluated by shear adhesion failure temperature per ASTM D4498; books stored in non-air-conditioned warehouses typically require SAFT above 65 °C. Page pull testing is conducted on a universal tensile tester with a crosshead speed of 50 mm/min. Production specifications commonly require the bonded page to fail by fibre tear in the paper rather than by clean glue-line peel. Finished components include perfect-bound softcover books, trade paperbacks, manuals, and catalogues.

    When Edgebanding Lines Demand Thin Slot Coats at High Line Speeds

    On high-speed edgebanders running 20–60 m/min, the slot nozzle temperature is commonly set between 180 °C and 200 °C. EVA 28150 provides the low melt viscosity necessary for a 60–120 g/m² coat weight without skip marks or stringing on ABS, PVC, HPL, and wood veneer edge tapes. The 28% vinyl acetate content improves wetting on polar PVC and wood-based edges relative to low-VA EVA grades, but it also narrows the upper service temperature limit. That limit must be managed with filler, wax, and process control rather than by increasing base resin concentration alone.

    Typical edgebanding formulations contain 30–45 wt% EVA 28150, 20–35 wt% hydrocarbon or rosin tackifier, 10–20 wt% wax, and 15–25 wt% calcium carbonate filler. Filler raises viscosity and heat resistance; the high melt flow rate compensates for the viscosity increase and permits thin-gap slot coat application. A critical process threshold is filler moisture. Calcium carbonate above 0.2 wt% moisture produces foaming and pinholes when the melt is held at 190 °C; filler must be pre-dried to 0.1 wt% or lower moisture before compounding. Published data for this specific EVA 28150/filler configuration is limited, but the observed foaming threshold is consistent with slot-die hot melt processing behaviour in woodworking lines.

    Compliance for interior wood bonding is assessed under EN 204 D3; the edge banding adhesive must maintain adhesion after water exposure at 23 °C for 4 days or equivalent exposure selected by the furniture manufacturer. Peel adhesion is measured at 23 °C and 50 mm/min crosshead speed using a 90° peel fixture. On production lines, premature skin-over in the slot die is avoided by holding the melt in a nitrogen-blanketed tank and purging every 8 h. Finished parts include cabinet doors, desktops, and office furniture edge treatments.

    Because automotive interior laminates are specified against long-term heat ageing and emissions rather than short-term green strength, EVA 28150 must be evaluated as part of a low-emission formulation rather than as a standalone adhesive. The polymer is used in bonding PVC or TPO skins to door armrests, laminating nonwoven scrim to headliner substrates, and positioning carpet or felt pads inside instrument panel carriers. In these processes, the adhesive is applied by roll coater or swirl-spray head at 160–180 °C to a coat weight of 20–60 g/m². Open time must remain above 10 s where vacuum forming or manual alignment is required. The 150 g/10 min melt flow rate supports thin film formation, but high flow also increases bleed-through on unbacked synthetic fabrics if coat weight exceeds 60 g/m².

    Emissions compliance is assessed by VDA 278. Many OEM interior specifications require volatile organic compound values below 100 µg/g and fogging values below 250 µg/g for the compounded adhesive. The base resin alone does not determine compliance; the tackifier, wax, and stabiliser package dominate emissions. Typical low-emission formulations use 25–40 wt% EVA 28150, 25–40 wt% hydrogenated tackifier, 0–10 wt% wax, and 0.5–1.5 wt% antioxidant/UV stabiliser. Heat ageing at 90 °C for 168 h is a common screening condition; creep is controlled by maintaining SAFT above 75 °C per ASTM D4498. The operational boundary for EVA 28150 in automotive laminate bonds is reached in continuous service above 90 °C, where creep accelerates unless substantial filler and high-melting wax are added. Finished laminates must survive service excursions from –30 °C winter soak to 90 °C interior solar load without delamination.

    Pleated Filtration Media Bonding: End Cap Potting Rheology

    In pleated air filter construction, EVA 28150 is applied to bond the pleated media pack to the end cap and side frame. The high melt flow rate at 170–190 °C allows the adhesive to fill narrow grooves in polyurethane or metal end caps without bubbling or starving sharp pleat tips. A gear pump with a bead applicator deposits 1.5–3.0 mm beads; the low viscosity reduces back pressure on the gear pump at start-up and allows high cycle rates on rotary pleating lines. This rheology is essential for high-density pleat packs where a thicker, low-flow adhesive would cause spring-back before the end cap potting solidifies.

    Formulation for filter end cap potting typically contains 35–50 wt% EVA 28150, 20–35 wt% tackifier, 5–15 wt% wax, and 0–10 wt% filler. For filters that must meet UL 900 Class 2 flammability, flame-retardant additives may be incorporated, but the base resin alone does not provide flame retardance. The compounded adhesive must pass room-temperature and hot tensile requirements for the media bond; many manufacturers specify that the adhesive-attached media fail cohesively in the filter media rather than adhesively at the glue line.

    Moisture in the filter media is a direct process limit. Media conditioned above 7 wt% moisture content causes steam release at the melt bead interface, producing pinholes and reduced potting strength; pre-conditioning to 3–5 wt% moisture is used before adhesive application. Finished components include HVAC panel filters, automotive cabin air filters, and industrial pocket filters.

    In footwear folding and upper assembly operations, hot melt adhesive is applied to folded edges of leather or synthetic upper materials before bonding to the lining. The 28% vinyl acetate content in EVA 28150 provides wetting on polar leather and PU-coated split leather; the 150 g/10 min flow rate permits application at 150–170 °C, which reduces heat marking and gloss change on coated leather surfaces. A folding machine nozzle deposits a 0.2–0.4 mm bead on the folded edge, followed by immediate nip roll pressure; set time is 2–5 s, and full bond strength develops after 24 h at 23 °C.

    Typical footwear formulations use 30–45 wt% EVA 28150, 20–35 wt% hydrocarbon tackifier, 5–15 wt% microcrystalline wax, and 0–5 wt% phenolic-modified resin for added heat resistance. Adhesion is evaluated by peel testing; SATRA TM411 is used for upper/lining bond strength in many footwear laboratories, with crosshead speed 100 mm/min. Because footwear can reach 60–70 °C in direct sunlight or vehicle storage, production specifications often require SAFT above 70 °C per ASTM D4498. The operational boundary is reached on unprimed nylon or silicone-treated synthetic leathers, where adhesion remains substrate-limited.

    EVA 28150 Has Process Advantages in Low-Stress Wire Tacking but Is Not a Structural Potting Compound

    In appliance and electronics assembly, wire tacking uses a rapid-setting hot melt to secure insulated conductors, flat flexible cables, and small coil leads to a base substrate before soldering or connector termination. EVA 28150 is applied at 160–180 °C through a micro-nozzle with bead diameter 0.3–0.5 mm. The high melt flow rate allows accurate dot placement without oversize fillet formation, which is critical when the wire-to-board clearance is below 1.0 mm. The adhesive functions as a positioning aid, not as a primary strain relief, unless the design intentionally limits the package to low mechanical load.

    The formulation for wire tacking uses 40–55 wt% EVA 28150, 20–30 wt% tackifier, 5–15 wt% wax, and optional flame retardant at 10–20 wt% for listings that require UL 94 V-0. Without flame-retardant additives, EVA 28150-based hot melts typically fail vertical burn tests, so the base resin is limited to low-stress tacking rather than permanent structural potting. Electrical assembly acceptance is often reviewed against IPC-A-610 for cable strain relief and component securing. A process constraint is thermal degradation in small heated nozzles. At hold temperatures above 180 °C for more than 4 h, EVA 28150 compounded hot melt can form char at the nozzle outlet, causing bead curvature and intermittent nozzle clogging; nitrogen blanketing and nozzle purge cycles every 4 h are required. Finished applications include loudspeaker coil dress, household appliance wire routing, and wire harness strain relief before final connector assembly.

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    Certification & Compliance
    More Introduction

    LG EVA 28150 is an ethylene-vinyl acetate copolymer resin designated as a hot-melt adhesive feedstock. The typical vinyl acetate content is 28% by mass, and the melt mass-flow rate is 150 g/10 min measured at 190 °C under 2.16 kg in accordance with ISO 1133-1:2022 or ASTM D1238-23. The supplied form is normally translucent pellets with a density of 0.95 g/cm³ at 23 °C and a residual moisture level below 0.1% by mass. Application areas include case and carton sealing, food packaging, bookbinding, profile wrapping, and general assembly adhesives where low melt viscosity, rapid wet-out, and adequate adhesion to polar substrates are required. The grade is not a structural adhesive raw material; it is intended for thermoplastic hot-melt formulations in which the copolymer is compounded with tackifiers, waxes, and stabilizers.

    What Is the Technical Significance of 28% VA and 150 MI in Hot-Melt Formulations?

    Vinyl acetate content is the primary polarity and crystallinity regulator in EVA copolymers. At 28% VA, the polyethylene segments retain limited crystallinity; differential scanning calorimetry on this VA class typically shows a broad endothermic event in the 60–75 °C range. The reduction in crystallite thickness lowers the melting point, increases optical clarity, and improves adhesion to cellulose, aluminium, polyester-coated board, and poly(vinyl chloride) relative to 18% VA grades. The polar vinyl acetate units also increase compatibility with rosin ester tackifiers, aromatic hydrocarbon resins, and polar adhesion promoters.

    The melt index of 150 g/10 min describes short-chain architecture with lower entanglement density. Under low shear, the resin exhibits a relatively low complex viscosity; in a formulated hot-melt, this contributes to application viscosities commonly within 500–1500 mPa·s at 180 °C, depending on tackifier level. However, low chain entanglement also reduces cohesive strength, tensile elongation at break, and creep resistance compared with grades having melt indices below 25 g/10 min. The resin therefore functions best when the adhesive formulation contains a tackifier system that raises green strength without forcing melt temperature beyond the thermal stability limit.

    At the molecular level, VA content also affects degradation chemistry. The ester side groups are thermally labile above 200 °C; acetic acid evolution can accelerate polymer degradation and corrode downstream metal surfaces. For this reason, melt temperatures should be maintained below 180 °C, and residence time in melters should be as short as possible. Nitrogen blanketing of melt tanks and addition of phosphite antioxidant at 0.2–0.5 wt% are common practices.

    Representative resin data for LG EVA 28150
    PropertyReference standardNominal value
    Vinyl acetate contentASTM D5594-1828% by mass
    Melt mass-flow rateISO 1133-1:2022 / ASTM D1238-23150 g/10 min at 190 °C, 2.16 kg
    DensityISO 1183-1:20190.95 g/cm³ at 23 °C
    Volatile or water contentISO 15512:2019< 0.1% by mass

    Processing Windows, Equipment Parameters, and Thermal Boundaries for LG EVA 28150

    Bulk handling of LG EVA 28150 normally requires standard pellet conveying and hopper systems. The high melt index of the resin does not require special drying under normal storage conditions. Storage is recommended below 35 °C and below 60% relative humidity to avoid surface moisture and pellet blocking. If pellets are exposed to humid ambient conditions and gloss or bubble formation occurs in the melt, desiccant drying at 50–60 °C for 2–4 h is sufficient. Air temperatures above 80 °C may cause pellet cluster formation in the hopper and should be avoided.

    Compounding is typically performed on a co-rotating twin-screw extruder with an L/D ratio of 40:1 to 52:1. Barrel settings generally range from 120 °C in the feed zone to 160 °C near the die, with die head temperature controlled at 140–170 °C. The low melt viscosity reduces motor amperage demand relative to low-MI grades, which is advantageous on torque-limited production lines. Screw speeds of 200–300 rpm are usually sufficient for dispersion; higher speeds may generate local frictional heat and must be balanced with adequate cooling in the extruder barrel zones. Vacuum venting is commonly used to remove trace moisture and low-molecular-weight volatile by-products.

    In hot-melt application equipment, the resin is processed in bulk melters, tank melters, or drum melters fitted with gear pumps. The working temperature is generally 160–180 °C. At these temperatures, the final formulated adhesive may be applied by roller, slot-die, or spiral-spray systems. Spiral-spray application with narrow orifice nozzles often requires viscosity reduction to approximately 300–800 mPa·s at 180 °C, while roller and slot-die systems accept higher viscosity ranges up to 1500 mPa·s. The high melt index of LG EVA 28150 supports low-temperature application and short open time; however, set speed and heat resistance must be adjusted with wax and tackifier selection rather than by relying only on the copolymer.

    Thermal processing above 200 °C should be avoided. Prolonged exposure at elevated temperature can produce acetic acid, increase color development, form gel particles, and reduce bond strength. Local exhaust ventilation is required at melters and coating heads. Equipment should not use copper or brass components in prolonged contact with molten EVA, because copper ions may accelerate oxidative degradation. Stainless steel, aluminium, or nickel-plated surfaces are preferred.

    When purging after processing, low-melt-index polyethylene or a commercial EVA purge grade is recommended. The resin should not be melted in equipment containing residues of chlorinated polymers or strong acidic contaminants. No intentional addition of amine-based additives is recommended, because some amines can accelerate ester degradation and color formation in EVA hot-melt systems.

    When LG EVA 28150 Is Compounded with Tackifiers and Waxes

    Hot-melt formulations based on LG EVA 28150 generally use 30–50 wt% polymer, 40–60 wt% tackifying resin, 5–20 wt% wax or diluent, and 0.3–1.0 wt% antioxidant. The final ratios depend on open time, viscosity, adhesion, and heat resistance requirements. Rosin ester tackifiers and aromatic modified hydrocarbon resins are usually compatible with this VA level. Aliphatic C5 resins may show limited compatibility and can produce phase separation if used at high loadings. A preliminary compatibility check by heated-stage microscopy or differential scanning calorimetry is advised before scale-up.

    Wax selection has a strong effect on set speed and cohesive strength. Fischer-Tropsch waxes with melting points of 80–105 °C are commonly used because they reduce melt viscosity and shorten open time. Microcrystalline waxes improve low-temperature flexibility but may reduce heat resistance. Excessive wax levels, particularly above 20 wt%, can produce brittle bonds, poor adhesion to coated board, and reduced peel strength. The high VA content of LG EVA 28150 generally permits good wet-out on low surface energy coatings after corona or primer treatment, but the resin alone does not guarantee adhesion on fluorine-modified or silicone-treated substrates.

    Mineral fillers such as calcium carbonate can be incorporated up to approximately 20 wt% for cost reduction. Filler loading raises high-shear viscosity, reduces tack, and may require higher application temperature. It is usually limited in high-speed packaging adhesives where nozzle clogging and pump wear are critical. For clean hot-melt lines, filler particle size should be below 10 µm and moisture content below 0.2%.

    Bond performance is evaluated using T-peel adhesion according to ASTM D1876-08, lap shear adhesion according to ASTM D1002-10, and heat-fail temperature according to ASTM D4498-07. Melt viscosity is measured by ASTM D3236-15 or ISO 2555:2018 using a Brookfield thermosel geometry at 180 °C. On coated board and paperboard, LG EVA 28150 has been used in case-sealing and bookbinding lines where fast fiber-tearing bond formation is required at low coating weights. The resin is also applicable to profile wrapping edge-bonding where adhesion to PVC edge banding or impregnated paper is needed.

    Regulatory support for adhesive formulators is typically based on FDA 21 CFR §175.105 for the finished adhesive and, where applicable, §177.1350 for ethylene-vinyl acetate copolymers as a component of food-contact articles. REACH registration status and RoHS Directive 2011/65/EU Annex II restrictions should be confirmed with the supplier’s safety data sheet. Published data for this specific product relative to site-specific environmental certifications may be limited; adequacy for food contact must be validated on the finished article under end-use conditions.

    In comparison with a conventional EVA having 18% VA and a similar 150 g/10 min melt index, LG EVA 28150 typically lowers the application temperature, increases adhesion to coated paper and polar plastics, and improves low-temperature flexibility. However, it also reduces resistance to nonpolar oils and may increase hot-melt stringing. In comparison with a 28% VA grade having an MI below 25 g/10 min, LG EVA 28150 reduces melt viscosity and improves penetration into porous substrates, but it gives lower cohesive strength and lower high-temperature creep resistance. In creep-sensitive assembly applications, a small addition of a higher-molecular-weight EVA or styrenic block copolymer can partially restore cohesive strength, although this may reduce clarity and specific adhesion.

    Comparative performance profile across representative EVA hot-melt resin configurations
    Resin configurationVinyl acetateMelt indexRelative melt viscosityRelative polar adhesionTypical selection driver
    LG EVA 2815028%150 g/10 minLowHighHigh-speed packaging, low-temperature application
    Low-VA high-MI EVA18%150 g/10 minLowModerateGeneral packaging, lower raw material cost
    High-VA low-MI EVA28%6–25 g/10 minHighHighCreep-resistant assembly adhesives
    Higher-VA very-high-MI EVA33%400 g/10 minVery lowHighSprayable or high-dilution tackifier systems

    On high-speed carton sealing lines, the low melt viscosity of LG EVA 28150 enables thin bond lines and rapid substrate penetration, but the final formulation must be adjusted for set speed because the low-molecular-weight polymer alone may remain soft or sticky after compression belts. In bookbinding side-glue applications, the resin can provide acceptable adhesion to uncoated paper and thin coated cover stock, while spine glue formulations may require combination with higher-viscosity EVA to maintain binding strength during repeated opening cycles. In profile wrapping, the resin is generally used in primer-free systems only when the substrate and edge material have been surface-activated; otherwise, a diluted primer or an atmospheric plasma treatment is required.

    Thermal-oxidative stability during storage and application should be confirmed by oven aging of the formulated adhesive at 150 °C for 24 h, followed by color and viscosity measurement. A color increase above 3 Gardner units or a viscosity drift above 10% from initial value indicates insufficient stabilizer loading or unacceptable residence time in the melter. These operational boundaries are specific to the final formulation and cannot be assigned to the resin alone. The resin has a limited operating window in high-temperature assembly adhesives; it is not a substitute for polyamide or polyurethane hot-melt grades in structural or load-bearing applications where service temperatures exceed 80 °C.