| HS Code | 170121 |
| Product Name | JA SOLAR PV encapsulant EVA Film |
| Manufacturer | JA Solar |
| Material Type | Ethylene Vinyl Acetate (EVA) |
| Application | Photovoltaic module encapsulation |
| Thickness | 0.4 mm to 0.6 mm |
| Width | Up to 1200 mm |
| Length | Up to 1000 m per roll |
| Vinyl Acetate Content | 28% to 33% |
| Light Transmittance | ≥ 91% |
| Density | 0.92 g/cm³ to 0.95 g/cm³ |
| Melting Point | 70°C to 90°C |
| Tensile Strength | ≥ 16 MPa |
| Elongation At Break | ≥ 500% |
| Adhesion Strength To Glass | ≥ 60 N/cm |
| Volume Resistivity | ≥ 1×10^15 Ω·cm |
| Dielectric Constant | 2.8 to 3.2 at 1 kHz |
| Breakdown Voltage | ≥ 20 kV/mm |
| Water Vapor Transmission Rate | ≤ 5 g/m²·day |
| Uv Cut Off Wavelength | ≤ 360 nm |
| Shrinkage | ≤ 3% |
| Gel Content | ≥ 75% |
| Color | Transparent |
| Shelf Life | 12 months |
| Storage Temperature | Below 30°C |
As an accredited JA SOLAR PV encapsulant EVA Film factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
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The JA Solar PV encapsulant EVA film enters flat-plate crystalline silicon module production as a vacuum-laminated interlayer. In a heated vacuum diaphragm laminator, the layup is assembled as tempered low-iron front glass, front EVA sheet, cell string matrix with copper ribbon interconnects, rear EVA sheet, and polymer backsheet. The front-side EVA is supplied at 0.45–0.60 mm; rear-side film is 0.50–0.60 mm. The vinyl acetate content is 28–33 wt%. The crosslinking package is an organic dialkyl peroxide at 0.6–1.0 wt%; a silane adhesion promoter is present at 0.2–0.5 wt%; antioxidant and UV stabilizer loadings are 0.1–0.3 wt%. The uncured melt flow rate is typically 20–30 g/10 min at 190 °C and 2.16 kg per ISO 1133-1:2022. Incoming rollstock should be stored at 5–10 °C and conditioned to room temperature at ≤40% RH for 4–6 h before layup. If the film has been exposed to relative humidity above 60% for more than 8 h, pre-drying at 50–60 °C for 4 h is required to prevent lamination voids.
The lamination cycle begins with chamber evacuation to below 100 Pa. Membrane pressure is applied at 0.08–0.10 MPa while the platen is held at 145 °C ± 2 °C. The EVA cure plateau is 10–15 min; total cycle time is 14–18 min for a 72-cell glass-backsheet module. The critical window is narrow. If the cell surface remains below 130 °C, gel content can fall below 70%, leading to creep at module operating temperatures above 90 °C. If local temperature exceeds 155 °C, rapid peroxide decomposition releases gaseous by-products that form edge bubbles and reduce peel strength. Production-scale laminator thermocouple mapping shows a 3–5 °C temperature gradient between the platen and the cell layer in glass-backsheet stacks; this gradient must be compensated in the thermal profile. Batch-to-batch melt flow rate variation should be held within ±3 g/10 min; broader variation changes the fill of cell gaps and the final encapsulant thickness over solder ribbons.
After cure, gel content by ASTM D2765-16 is 70–90%. Peel strength to clean low-iron glass by ASTM D1876-08 is 40–80 N/cm. Optical transmittance by ASTM D1003-21 is ≥91%, haze is ≤2.5%, and yellowness index by ASTM E313-20 is ≤2.0. Volume resistivity after cure is ≥1×10^14 Ω·cm per IEC 62788-1-2. Shrinkage at 120 °C for 3 min by ASTM D1204-14 is ≤2.0%. The table below summarizes industrial acceptance values for glass-backsheet modules using this EVA type.
| Property | Test method | Industrial acceptance range |
|---|---|---|
| Gel content after cure | ASTM D2765-16 | 70–90% |
| Light transmittance | ASTM D1003-21 | ≥91% |
| Haze | ASTM D1003-21 | ≤2.5% |
| Yellowness index | ASTM E313-20 | ≤2.0 |
| Peel strength to glass | ASTM D1876-08 | 40–80 N/cm |
| Volume resistivity | IEC 62788-1-2 | ≥1×10^14 Ω·cm |
| Shrinkage at 120 °C for 3 min | ASTM D1204-14 | ≤2.0% |
For cadmium telluride and copper indium gallium diselenide thin-film modules, the transparent conductive oxide layer and front scribe interconnects impose a lower thermal budget than crystalline silicon laminates. EVA front encapsulation is processed at 135–140 °C, with a shorter cure soak of 8–12 min. A fast-cure peroxide blend is used at 0.7–1.2 wt%, and the silane coupling agent is raised to 0.3–0.5 wt% to wet molybdenum back contacts and glass. The melt flow rate is higher than standard crystalline-silicon EVA, commonly 25–40 g/10 min at 190 °C and 2.16 kg per ISO 1133-1:2022, allowing flow around laser scribe edges without displacing the interconnect strip. Vacuum is below 90 Pa; pressure is reduced to 0.06–0.08 MPa to avoid fracturing edge-deletion zones. After lamination, gel content is 65–85%. Damp-heat exposure per IEC 61215-2:2021 at 85 °C and 85% RH for 1000 h is the critical qualification test. EVA hydrolysis under damp heat releases acetic acid; zinc oxide-based transparent conductors are particularly sensitive. Published data for this specific configuration is limited, but production practice places a polyisobutylene or butyl edge seal between the glass edges and the EVA layer in thin-film modules. The finished product is a glass-glass thin-film module with a laminated front encapsulant that must maintain red-region transmittance above 88% and yellowness index change below 2.0 after damp heat.
Across dual-glass bifacial module lines, the rear EVA layer is not merely a mechanical cushion. Rear-side grades use VA content at 30–32 wt%, UV stabilizers at 0.2–0.4 wt%, and a silane adhesion promoter optimized for glass-glass bonds. The dual-glass laminator is set to 145–150 °C; soak time is 15–20 min because the rear glass acts as an additional thermal mass. Production thermocouple data show that the cell layer reaches the platen setpoint 4–6 min later than in glass-backsheet stacks. Vacuum evacuation is ramped to 70 Pa, and pressure application is delayed until the edge glass temperature exceeds 120 °C to prevent underflow at cell gaps. Gel content after cure should be 75–90%. Transmittance through the rear EVA between 300–1200 nm should be ≥90%, with haze ≤1.5% by ASTM D1003-21. Potential-induced degradation is the major long-term risk; the rear glass often provides an additional leakage path, and cured EVA volume resistivity should remain ≥1×10^14 Ω·cm at 25 °C and ≥1×10^12 Ω·cm at 85 °C per IEC 62788-1-2. UV preconditioning at 60 kWh/m² per IEC 61215-2 should produce yellowness index change ≤2.0. The terminal product is a glass-glass bifacial module with rear-side optical gain and front-side cell strings fully encapsulated without backsheet curl.
Building-integrated photovoltaic modules must satisfy both photovoltaic qualification and civil construction codes. In facade and spandrel units, the EVA film is cured between two panes of heat-strengthened or tempered glass with thicknesses from 4 mm to 10 mm. After vacuum bag lamination, a high-pressure autoclave at 0.8–1.2 MPa and 120–135 °C removes residual air and reduces laminate voids to below 0.5%. EVA interlayer thickness in safety glazing is commonly 0.76 mm; PV active laminates may use 0.45–0.60 mm when the cell circuit is embedded. Peel strength to glass after autoclave cure is specified above 50 N/cm by ASTM D1876-08. Safety glazing impact is validated by EN 12600; PV construction requirements are tested per IEC 61730-1:2023. Reaction-to-fire classification under EN 13501-1 or ANSI/UL 1703 is determined on the complete laminate assembly; the EVA polymer itself is combustible, so fire performance cannot be assigned to the encapsulant alone. Facade operating temperatures can exceed 70 °C; cured EVA should show creep displacement no greater than 0.5 mm after 24 h at 85 °C under glass dead load. Structural sealant compatibility is a boundary condition; uncured silicone or polysulfide sealants in contact with the EVA edge can cause local adhesion loss due to solvent migration or cure interference. Butyl edge tape is the preferred separation layer. The table below summarizes the typical compliance matrix for EVA-containing BIPV laminates shipped into the European and North American construction markets.
| Standard or regulation | Area | Operational boundary or acceptance basis |
|---|---|---|
| IEC 61215-1:2021 | Terrestrial PV qualification | Damp heat 1000 h, thermal cycling 200 cycles, humidity freeze 10 cycles |
| IEC 61730-1:2023 | Module safety construction | Electrical insulation, creepage, and bonding tests on finished laminate |
| ANSI/UL 1703 | Flat-plate PV fire and electrical safety | Fire class assigned to complete module, not encapsulant alone |
| EN 13501-1 | Reaction-to-fire for BIPV glazing | Classification on full glass-encapsulant-cell assembly |
| REACH EC 1907/2006 | SVHC screening | No SVHC above 0.1 wt% in supplied film |
| RoHS Directive 2011/65/EU | Restricted substances | Pb, Cd, Hg, Cr6+ below homogeneous-material limits |
Curved vehicle-integrated photovoltaic roofs and hood inserts are processed with matched-mold vacuum presses and 3D-machined silicone membranes. Lamination temperature is held at 130–138 °C because automotive glass is thin and warpage-sensitive. Total cure time extends to 20–25 min because curved glass heat transfer is nonuniform; local hotter zones near tooling contact points can produce gel content differences of 5–10 percentage points across a single laminate. The EVA formulation is adjusted to a lower final gel content of 65–80% to retain elongation during thermal cycling from -40 °C to 105 °C. Peel strength to curved chemically tempered glass by ASTM D1876-08 is typically 30–60 N/cm; lower values are accepted because curved glass residual stress and cell string steps concentrate peel forces at the cell edges. Damp-heat and thermal-cycle tests follow IEC 61215 and ISO 16750-3. The terminal product is a curved solar roof or hood insert with integrated cells, laminated behind a weather-resistant front layer. Polycarbonate automotive backsheets are incompatible with this EVA in high-temperature service; residual peroxide and acetic acid can stress-crack polycarbonate at rib radii. A coextruded polyolefin/EVA or polyolefin-only encapsulant is advised in such designs. Published data for EVA adhesion on curved chemically strengthened glass is limited; coupon-level flat-glass adhesion testing is not a full substitute for curved-laminate peel validation.
Continuous moisture ingress in floating solar arrays shifts the dominant EVA failure mode from ultraviolet yellowing to hydrolytic deacetylation. Low-acid formulations use vinyl acetate content at 26–29 wt% and an acid scavenger at 0.1–0.3 wt% to slow hydrolysis. The laminator setpoint remains 142–146 °C; vacuum is below 90 Pa; cure soak is 12–14 min. After 2000 h damp heat at 85 °C and 85% RH, peel strength to glass should retain at least 60% of the initial value. Standard EVA formulations may fall below 50% retention under the same conditions. Saline and brackish water environments add salt-mist testing per IEC 61701. The terminal product is a floating solar module mounted on a pontoon array; edge protection uses polyisobutylene tape or butyl sealant because the EVA edge is the primary moisture ingress path. Published data for EVA hydrolysis kinetics in brackish water vapor exposure is limited; damp-heat testing remains the laboratory proxy for long-term floating-array durability.
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JA SOLAR PV encapsulant EVA Film is supplied as an uncured, peroxide-crosslinkable ethylene-vinyl acetate monolayer for photovoltaic lamination. The product family is differentiated by thickness, width, roll length, surface texture, and cure speed. Model-specific part numbers are given in the manufacturer’s bill-of-materials datasheet; where the public datasheet does not disaggregate part numbers, the applicable type is selected from the module line’s laminator profile and cell technology. The compound is based on ethylene-vinyl acetate resin with vinyl acetate content in the 28–33 wt% range. The formulation includes an organic peroxide cure initiator, a silane coupling agent for glass adhesion, an ultraviolet absorber, and a hindered amine light stabilizer. Standard thickness is 0.45 mm to 0.60 mm, width capacity is commonly up to 2200 mm, and roll length is specified by layup dimensions. The film is interleaved or embossed to prevent blocking and is cut to cell-matrix dimensions.
The primary use is front-side and rear-side encapsulation of p-type PERC, n-type TOPCon, and passivated-emitter rear-contact cell modules. In bifacial glass-glass constructions, the film may be used on the rear side only in combination with low-water-vapour-transmission edge seals. RoHS screening is conducted under Directive 2011/65/EU; REACH SVHC status is provided in the manufacturer’s safety data sheet.
Uncured film is formulated to melt, wet glass and cell surfaces, and fill ribbon and busbar gaps before peroxide decomposition builds crosslink density. The melt flow index of an uncured EVA sheet in this class, measured under ASTM D1238-20 at 190 °C/2.16 kg, is typically 15–40 g/10 min. After lamination, gel content measured by solvent extraction to ASTM D2765-16 is normally 75–90%, balancing adhesion, creep resistance, and optical clarity. Under-cured encapsulant with gel content below 70% exhibits elevated creep and reduced glass adhesion after thermal cycling; over-cured film above 95% gel fraction becomes brittle and yellows more rapidly under damp-heat exposure. The vinyl acetate content controls clarity, adhesion, and water vapour transmission; higher vinyl acetate improves optical coupling but increases hydrolysis potential and lowers volume resistivity. This product class therefore occupies a narrow compositional window.
Differential scanning calorimetry of unaged compound shows a cure exotherm with onset near 115–125 °C, peak temperature from 140 °C to 170 °C at 10 °C/min, and total exotherm typically 15–30 J/g. The production lamination window is bounded by two failure modes: insufficient peroxide decomposition before the platen press releases, and premature skinning before bubble evacuation. On a single-chamber or multi-chamber vacuum laminator, the film is heated under vacuum of ≤1 mbar before membrane pressure is applied at 0.08–0.10 MPa. Typical platen setpoints are 145–155 °C for conventional cure grades and 135–145 °C for fast-cure grades; dwell at full vacuum and pressure ranges from 8 min to 15 min. The effective processing window is approximately ±5 °C on platen setpoint and ±30 s on dwell because gas extraction at ribbon crossings must be completed before the EVA viscosity drops below 1×104 Pa·s during melt flow. If the platen setpoint exceeds 170 °C, the peroxide half-life shortens sharply, and crosslinking at the glass interface can proceed before complete void evacuation, leaving edge bubbles, ribbon shadows, and low local gel content under interconnects. On multi-chamber lines such as Ecoprogetti, NPC, or Meyer Burger configurations, the pin-up chamber is operated with glass-side heating to induce first melt on the glass rather than the cell side. Lamination pressure is held until the cavity reaches plateau temperature; premature release of the membrane before gel formation produces rebound voids at ribbon edges.
Product-class acceptance ranges are listed in Table 1. These values are representative of peroxide-cured photovoltaic EVA films with 28–33 wt% vinyl acetate and are not a substitute for JA Solar’s model-specific certificate of analysis.
| Property | Test method | Typical range / value |
|---|---|---|
| Thickness | ASTM D374-16 | 0.45–0.60 mm |
| Density | ASTM D792-20 | 0.94–0.97 g/cm³ |
| Melt flow index, uncured | ASTM D1238-20 at 190 °C/2.16 kg | 15–40 g/10 min |
| Total transmittance after lamination | ASTM D1003-21 | >91% |
| Haze after lamination | ASTM D1003-21 | <3% |
| Yellowness index before aging | ASTM E313-20 | <1.5 |
| Tensile strength at break | ASTM D882-18 | 14–25 MPa |
| Elongation at break | ASTM D882-18 | 450–700% |
| Gel content after lamination | ASTM D2765-16 | 75–90% |
| Volume resistivity | ASTM D257-14 | >1×1014 Ω·cm |
| Adhesion to glass after lamination | Internal T-peel method aligned with IEC 61215-2:2021 | >60 N/cm |
| Shrinkage at 120 °C/3 min | ASTM D1204-14 | <3% |
| Water vapour transmission rate at 38 °C/90% RH | ASTM F1249-20 | 25–45 g/m²·day |
Values are product-class ranges, not batch-specific guarantees. Batch-specific data are supplied with the manufacturer’s certificate of analysis.
EVA differs from alternative encapsulants in moisture transport, hydrolysis by-products, and lamination profile. PVB requires external plasticizer and usually autoclave lamination; plasticizer migration to ribbon surfaces can weaken bus-ribbon adhesion. EVA contains no external plasticizer, which removes that migration mode but introduces acetic acid from vinyl acetate hydrolysis under damp-heat or high-temperature field aging. POE has lower water vapour transmission, higher volume resistivity, and greater PID resistance under damp-heat bias testing; however, POE often requires higher lamination temperature or longer tacking and is more expensive. Ionomer offers high clarity and creep resistance at elevated temperature but demands higher lamination temperatures and is less common in commodity modules. Silicone provides long-term photothermal stability with low modulus but is higher in cost and requires different edge seal systems. The selection of EVA versus POE is commonly driven by leak-current and damp-heat failure thresholds, not by initial adhesion alone.
| Attribute | EVA | POE | PVB | Ionomer |
|---|---|---|---|---|
| Water vapour transmission at 38 °C/90% RH | 25–45 g/m²·day | 5–15 g/m²·day | 20–40 g/m²·day | 10–20 g/m²·day |
| External plasticizer | No | No | Yes | No |
| Acetic acid generation under hydrolysis | Yes | No | Low | No |
| Typical lamination condition | 145–155 °C vacuum | 150–170 °C vacuum | 130–150 °C autoclave | 160–180 °C vacuum |
On production lines, typical EVA-related lamination defects are edge voids, ribbon ghosting, snail trails after damp-heat exposure, and post-laminate delamination from backsheets. Edge voids are traced to insufficient outgassing during vacuum, often when the vacuum stage is shortened below the lower dwell limit or when the film contains absorbed moisture. The film is hygroscopic; packages opened for more than 4 h at RH >60% should be pre-dried at 65–75 °C for 12–24 h before layup. Batch-to-batch variation in silane coupling-agent retention influences glass peel adhesion after aging; incoming inspection should verify FTIR spectra against the certified reference, gel content after laboratory lamination, thickness profile, and surface embossing depth. Film stored beyond the manufacturer’s shelf life can exhibit premature crosslinking or loss of tack and should be quarantined. Storage in unopened aluminium packaging at 5–30 °C is required; shelf life is typically 9–12 months. The product must not be stored in contact with amine-containing additives, strong bases, or open oxidizers; these agents can accelerate peroxide decomposition and shorten the usable layup window.
Front-side use requires total transmittance after lamination of at least 91% at 550 nm and haze below 3% by ASTM D1003-21. The refractive index of EVA is approximately 1.48–1.50, close to low-iron solar glass to minimize interfacial reflectance. Ultraviolet absorber chemistry screens UV wavelengths below approximately 360 nm to reduce photobleaching, an operational boundary for UV-responsive cell designs. Volume resistivity after lamination must remain above 1×1014 Ω·cm by ASTM D257-14 to limit leakage current from cell to frame. Wet leakage and electrical insulation are evaluated at module level under IEC 61215-2:2021 and IEC 61730-1:2016 because encapsulant, backsheet, and edge seal function as a system. In bifacial glass-glass constructions, rear-side EVA is also assessed for UV blocking and moisture transport because the rear sheet contributes to rear-side irradiance gain and acetic-acid distribution.
Typical layup sequence for monofacial modules is glass / front EVA / soldered strings / rear EVA / backsheet. The cell string is placed onto the first encapsulant sheet and should not be repositioned after partial melt begins. Solder ribbon thickness from 0.20 mm to 0.35 mm requires an encapsulant thickness and melt-flow profile that conforms to the ribbon edge without leaving air channels. For PERC and TOPCon cell types, the rear EVA is selected for low acid generation or thin profile to reduce corrosion risk; for heterojunction cells, POE is often substituted at the cell interface. For bifacial glass-glass modules, fast-cure EVA may be paired with a POE layer adjacent to the cell to reduce PID. The EVA layer is not recommended as the only interfacial layer for heterojunction cells where published data for this specific configuration is limited. Lamination recipe, incoming moisture control, and backsheet permeability must be treated as a single process window; variations in any one parameter shift the acceptable dwell, pressure, and platen temperature.