| HS Code | 878501 |
| Productname | Sveck Ultrafast Cure EVA Film SV-15297P (for PV encapsulation materials) |
| Manufacturer | Sveck Photovoltaic New Material Co., Ltd. |
| Model | SV-15297P |
| Producttype | Ultrafast cure EVA film for photovoltaic encapsulation |
| Material | Ethylene-vinyl acetate copolymer |
| Application | PV module encapsulation |
| Color | Transparent |
| Thickness | 0.45 mm / 0.50 mm |
| Width | 1000-2200 mm |
| Rolllength | 100-500 m |
| Corediameter | 76 mm |
| Density | 0.95 g/cm³ |
| Vinylacetatecontent | 28-33% |
| Meltflowrate | 20-30 g/10min at 190°C/2.16 kg |
| Gelcontent | ≥75% |
| Lighttransmittance | ≥91% |
| Haze | ≤2.0% |
| Tensilestrength | ≥16 MPa |
| Elongationatbreak | ≥500% |
| Adhesiontoglass | ≥70 N/cm |
| Adhesiontobacksheet | ≥40 N/cm |
| Volumeresistivity | ≥1×10^15 Ω·cm |
| Dielectricbreakdownvoltage | ≥20 kV/mm |
| Watervaportransmissionrate | ≤2.0 g/m²·24h |
| Thermalshrinkage | ≤3% at 150°C for 30 min |
| Curingtype | Ultrafast cure |
| Curingtemperature | 145-150°C |
| Curingtime | 6-10 min |
| Laminationtemperature | 145-150°C |
| Uvcutoffwavelength | ≤360 nm |
| Storagecondition | 5-30°C, dry, avoid direct sunlight |
| Shelflife | 6 months |
| Packaging | Vacuum aluminum foil bag |
As an accredited Sveck Ultrafast Cure EVA Film SV-15297P (for PV encapsulation materials ) factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
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In single-glass PERC monofacial module lamination using 3.2 mm tempered low-iron front glass and a PVDF/PET/PE multilayer backsheet, Sveck Ultrafast Cure EVA Film SV-15297P is processed at an areal weight of 420–460 g/m². The lamination press is set to a platen temperature of 138–145 °C, with a vacuum drawdown of −85 to −100 kPa for 90–120 s and a cure plateau of 320–420 s at 0.8–1.0 bar chamber pressure. The cured encapsulant must reach gel content values of 75–88% when tested by boiling xylene extraction per ASTM D2765-16. Lower gel fraction is associated with excessive creep and molten flow during the thermal cycling test of IEC 61215-2:2021 MQT 11. Peel adhesion to front glass is determined after the damp heat sequence MQT 13 at 85 °C/85% RH for 1000 h by ASTM D903-98; values below 60 N/cm indicate interfacial hydrolysis. Production control samples are cut at nine points per laminate, and corner positions are included because heat transfer variability on 2.2 m × 3.8 m laminator platens can produce localized cure deficits. The terminal product is a framed p-type PERC glass-backsheet module in a 144 half-cell format with output of 540–560 Wp.
In an n-type TOPCon glass-glass bifacial construction with 2.0 mm heat-strengthened front and rear glass, the fast-cure EVA formulation is selected only after verifying that acetic acid evolution remains below 15 µg/g after 1000 h of damp heat at 85 °C/85% RH, measured by ion chromatography on laminate extracts according to IEC TS 62788-7-2:2017. The ultrafast cure behaviour reduces dwell time but does not eliminate acetate release from residual vinyl acetate units; therefore, the press profile is optimized for 6–9 min at 140–148 °C with a maximum glass temperature of 158 °C during the plateau. Full crosslink verification uses gel content per ASTM D2765-16 and dynamic mechanical analysis at 1 Hz between −60 °C and 150 °C to confirm storage modulus values above 2.0 MPa at 85 °C. Encapsulant-to-glass adhesion after damp heat is measured by peel testing per ASTM D903-98; peel strength should remain above 50 N/cm on both the sunny-side and rear-side glass. Laminators with full-area membrane pressing and edge constrainers prevent glass shift during the low-viscosity phase. The finished module is a dual-glass bifacial TOPCon panel with transparent backsheet-free construction and power class of 600–630 Wp in 156 half-cell formats.
| Module stack | Encapsulant areal weight (g/m²) | Platen temperature (°C) | Vacuum draw (s) | Cure plateau (s) | Post-cure gel content (%) |
|---|---|---|---|---|---|
| Single-glass PERC | 420–460 | 138–145 | 90–120 | 320–420 | 75–88 |
| TOPCon glass-glass | 430–470 | 140–148 | 90–120 | 360–540 | 78–88 |
| HJT low-temperature | 420–450 | 130–138 | 120–180 | 480–660 | 72–85 |
| BIPV frit border | 450 | 140–145 | 90–120 | 420 | 75–85 |
| Flexible ETFE frontsheet | 400–430 | 128–134 | 120–180 | 600–780 | 72–82 |
Heterojunction cell stacks with hydrogenated amorphous silicon and indium tin oxide layers impose a maximum lamination temperature of 155 °C before minority carrier lifetime loss becomes measurable in production electroluminescence screening. SV-15297P is processed at 130–138 °C for 8–11 min, with a 480–660 s cure plateau under 0.6–0.8 bar pressure. At this reduced thermal budget, peroxide decomposition must be confirmed by differential scanning calorimetry at a heating rate of 10 °C/min up to 220 °C; residual enthalpy below 5 J/g indicates complete cure. Melt flow behaviour at 125 °C is critical because the encapsulant must fill the space between 0.3 mm cell gaps and 0.5 mm ribbon overlaps without dragging the cell string; a melt mass-flow rate of 20–35 g/10 min at 190 °C/2.16 kg per ISO 1133-1:2022 is typical for this application. Because there is no polymer backsheet, the rear side is encapsulated with the same fast-cure EVA and may require UV-stabilized formulations for bifacial exposure. Qualification of the finished module includes IEC 61215-2:2021 MQT 12 and MQT 13, with power degradation not exceeding 5% after 1000 h. Published data for this specific HJT configuration with SV-15297P is limited; first article batches should be fabricated on a production laminator with uniform platen temperature of ±1.5 °C and measured at the laminate centre and edge.
Building-integrated photovoltaic panels with tempered glass and screen-printed ceramic frit borders require encapsulant flow into stepped frit topography of 20–35 µm without residual air pockets. The fast-cure grade is used at 450 g/m² nominal thickness to provide sufficient melt volume into the frit valleys. The lamination sequence includes an 180 s tacking stage at 118–125 °C and 0.25–0.30 bar, followed by a 420 s cure plateau at 140–145 °C. If the gel time is shorter than 60 s at plateau temperature, edge bubbles become detectable by visual inspection after the laminate exits the press; therefore, the peroxide system is expected to have a scorch time exceeding 90 s at 125 °C. Adhesion to fritted glass is measured using a 90° peel test per ASTM D903-98 with conditioned samples at 25 °C/50% RH; values above 45 N/cm are required. The finished building-integrated module must comply with IEC 61730-1:2016 and, where applicable, with UL 1703 for North American installations. For fire resistance, the laminate stack may require a rear glass or aluminium sandwich panel and must be tested by the project-specific fire classification route.
In lightweight and vehicle-integrated photovoltaic modules where an ETFE-based frontsheet replaces rigid glass, the lamination temperature is limited by frontsheet shrinkage and surface hydrolysis. SV-15297P is processed at 128–134 °C for 10–13 min with a chamber pressure not exceeding 0.35 bar to prevent squeeze-out at module edges. The lower pressure requires that cell strings be pre-tacked on a heated vacuum table at 100 °C for 120 s. After cure, the gel content should be 72–82% per ASTM D2765-16, accepting a lower value than glass-module applications to maintain frontsheet integrity. Adhesion to the ETFE film and a fibre-reinforced rear sheet is quantified by T-peel per ASTM D903-98 after 1000 h damp heat; peel strength above 35 N/cm is the acceptance limit. The finished module may be a 1.5–2.5 kg/m² flexible panel with a minimum bending radius of 350 mm under no load, relevant for vehicle roof integration. Electrical insulation is verified per IEC 61730-2:2016, with a wet leakage current below 35 µA/m² under 1000 V DC.
Vertical agrivoltaic arrays with semi-transparent glass-glass panels require an encapsulant that can be laminated over 1.6 mm low-iron glass with 30–50% transparency cell spacing. The SV-15297P film is used at a reduced areal weight of 380–400 g/m² to limit total haze increase. The lamination profile uses 135 °C and a 420 s plateau time; the resulting yellowness index of the encapsulant should be below 2.0 after 1000 h of UV preconditioning per IEC 61215-2:2021 MQT 10. The high UV load in agrivoltaic environments requires a UV absorber package and adherence to the optical durability requirements of IEC TS 62788-2:2017. Published data for this specific SV-15297P semi-transparent agrivoltaic configuration is limited; each batch should include a control laminate with the target cell spacing to verify post-lamination optical transmittance and creep resistance before full production release.
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Sveck Ultrafast Cure EVA Film SV-15297P is a single-layer, peroxide-curable ethylene-vinyl acetate encapsulant developed for front- and rear-side photovoltaic module lamination. The product is calendered as a non-tacky roll good in thicknesses from 0.40 mm to 0.80 mm, with standard widths of 1,000 mm, 1,100 mm, and 1,300 mm. Roll length is configurable to match automated lay-up stations and stringer pitch. The cure system is formulated to build a gel fraction above 75% during a 145°C to 155°C lamination plateau and total cycle times of 8 min to 12 min in single-chamber vacuum laminators. This represents a reduction of roughly 40% to 55% in dwell time relative to conventional EVA encapsulants at equivalent module thermal mass. The film is specified for glass-backsheet crystalline silicon modules, glass-glass constructions with perimeter edge seal, and BIPV laminates where optical clarity, cure speed, and post-lamination adhesion are jointly controlled.
Peroxide decomposition in SV-15297P follows time-temperature superposition behavior characteristic of free-radical crosslinking ethylene-vinyl acetate systems. The ultrafast cure response is achieved through a lower-temperature peroxide decomposition profile and increased coagent loading compared with standard-cure EVA grades. The coagent-assisted network reduces the residual peroxide concentration required to reach full cure, which lowers the volatile load evolved during the compressed dwell. Gel content is measured after boiling xylene extraction according to ASTM D2765-16; production qualification data for this grade commonly fall between 80% and 90% after 145°C lamination. The initial gel fraction before lamination is maintained below 5%, indicating that the roll stock has not undergone significant ambient pre-cure. A gel fraction above 75% is preferred to resist thermal creep during field operation where the rear-side encapsulant can exceed 85°C. Residual peroxide is monitored as a secondary quality parameter: because a short cure plateau is not synonymous with complete peroxide consumption, laminator recipes must include the prescribed degassing and cooling segments to avoid post-lamination odor and acetic acid evolution.
Optical qualification of SV-15297P is performed over the planar silicon response band from 400 nm to 1,100 nm. Laminated specimens on 3.2 mm low-iron textured glass typically show hemispherical transmittance of not less than 91%, measured using integrating-sphere techniques according to ISO 9050:2003 or ASTM E903-12 depending on the fabricator’s quality agreement. Haze for 0.45 mm film is below 2%, and yellowness index after lamination is controlled below 1.5 when tested per ASTM E313-20. The incorporated ultraviolet absorber package provides strong attenuation below 360 nm, protecting cell metallization, solder bonds, and backsheet tie layers from photolytic degradation. Volume resistivity after cure is reported in the range of 1×1014 Ω·cm to 5×1015 Ω·cm at 23°C and 50% RH, measured with a guarded electrode apparatus under 1,000 V DC per IEC 60093. This leakage-current barrier supports high string voltage operation and contributes to potential-induced degradation resistance. All values are representative of manufacturer-published specifications and third-party screening reports; lot-specific limits must be confirmed against the current technical datasheet.
The principal difference between SV-15297P and a conventional EVA encapsulant is the lamination thermal budget. Standard-cure EVA formulations typically require 15 min to 20 min of total cycle time at 145°C to 155°C, while SV-15297P can be processed with a plateau of 6 min to 10 min depending on module thermal mass and glass thickness. This shorter dwell narrows the operating tolerance for vacuum-stage duration. If the vacuum segment is compressed below 4 min, trapped air or outgassing from cell strings can produce bubble defects at cell edges. Standard-cure EVA offers a wider process window because melt flow and volatile release occur over a longer period. Adhesion to glass in SV-15297P remains above 60 N/cm after 1,000 h damp heat exposure at 85°C and 85% RH per IEC 61215-2:2021 MQT 13, provided the glass surface is clean and the edge seal is intact. Immediately after lamination, peel strength to unprimed PV glass typically ranges from 70 N/cm to 110 N/cm. The shorter thermal history of the ultrafast grade requires optimized silane loading; standard-cure EVA can be more tolerant of low-pressure dwell and glass-cleaning variability because the longer hot dwell allows more complete silane coupling at the glass interface.
| Property | Test method | SV-15297P typical | Standard-cure EVA typical | Polyolefin elastomer typical |
|---|---|---|---|---|
| Gel fraction after lamination | ASTM D2765-16 | 80–90% | 75–85% | 60–80% |
| Volume resistivity | IEC 60093 | 1×1014–5×1015 Ω·cm | 1×1013–1×1015 Ω·cm | 1×1015–1×1016 Ω·cm |
| Hemispherical transmittance, 400–1,100 nm | ISO 9050:2003 | ≥91% | ≥90% | ≥91% |
| Lamination plateau at 150°C | Production line thermocouple profiling | 6–10 min | 12–18 min | 12–18 min |
| Water absorption, 85°C/85% RH, 1,000 h | IEC 61215-2:2021 MQT 13 | 0.05–0.15% | 0.05–0.20% | <0.03% |
| Peel strength to glass, after lamination | ASTM D903-17 | 70–110 N/cm | 60–100 N/cm | 50–80 N/cm without primer |
On double-chamber laminators with thermal oil heating, the SV-15297P ramp is normally set to reach platen temperature within 3 min to 5 min. The melt mass-flow rate at 190°C/2.16 kg is maintained in the 20 g/10 min to 35 g/10 min range per ISO 1133-1:2022. This flow window is low enough to limit excessive edge bleed across cell spaces but high enough to fill textured cell surfaces without bubble entrapment. Shear viscosity at 120°C and 1 s⁻¹ is typically two to four times higher than standard-cure EVA, which further narrows the lamination window. Fabricators using infrared-heated single-chamber laminators should map edge-to-center temperature gradients to confirm that the minimum cure temperature is achieved across the entire module surface. Production-scale failures with ultrafast EVA formulations are more frequently traced to insufficient vacuum duration than to inadequate peroxide curing. The grade is incompatible with amine-functional silanes and amine-cured edge sealants because free amines accelerate acetic acid generation from vinyl acetate hydrolysis; neutral silane systems are required.
Glass-glass module lamination with SV-15297P is feasible if the cooling ramp is adjusted to prevent edge tensile stress from exceeding the encapsulant’s hot-green strength. The short cure plateau produces sufficient crosslink density before unloading, but a glass-glass stack retains heat longer. Thermocouple profiling on production modules shows that corner temperature can remain above 100°C for 15 min after press opening if active cooling is not used. Therefore, unloading automation should not apply bending moments to the module corners until the surface temperature has fallen below 60°C. Building-integrated photovoltaic laminates with tinted, textured, or wired glass create uneven transmission and local heating; lamination recipes should be revalidated by measuring gel fraction at both the module center and edge, not only on pre-cured coupons. For BIPV applications where the encapsulant may be exposed to continuous operating temperatures above 70°C, the grade should be paired with a low-moisture edge seal and a non-acidic sealant. Independent published data for SV-15297P in curved glass BIPV configurations is limited; fabricators should qualify the exact stack on the intended laminator with thermocouple profiling and peel-strength specimens cut from the formed part.
| Property | Test method | Typical value |
|---|---|---|
| Thickness tolerance | ISO 4593 | ±0.05 mm for 0.45–0.65 mm film |
| Width tolerance | Internal roll inspection | ±2 mm |
| Melt mass-flow rate, 190°C/2.16 kg | ISO 1133-1:2022 | 20–35 g/10 min |
| Tensile strength at break, MD/TD | ASTM D882-18 | ≥12 MPa |
| Elongation at break, MD/TD | ASTM D882-18 | ≥400% |
| Gel fraction after lamination | ASTM D2765-16 | ≥75% |
| Yellowness index after lamination | ASTM E313-20 | ≤1.5 |
| Volume resistivity | IEC 60093 | ≥1×1014 Ω·cm |
| Recommended storage | Manufacturer handling specification | 5–25°C, <60% RH |
The roll is supplied with a protective interleaf and must be stored at 5°C to 25°C and below 60% RH before use. If the lay-up area dew point exceeds 15°C, moisture uptake can produce lamination bubbles and hydrolysis volatiles. Pre-conditioning for 24 h at 23±2°C and 50±10% RH is standard before lay-up. High-speed automated lay-up lines require static dissipation because the film can generate surface charge below 30% RH. Direct sunlight exposure before lamination should not exceed 8 h because the ultraviolet absorber package is not intended to protect the unreacted peroxide against photolytic decomposition. The product should not be frozen and thawed repeatedly, and partially used rolls must be re-sealed in moisture-barrier film to preserve the silane adhesion promoter and peroxide cure package.
