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Anhui Liwei Chemical Co., Limited.

TAFMER PN Series EVA Modification Film

    • Product Name: TAFMER PN Series EVA Modification Film
    • Factroy Site: Lingwu, Yinchuan, Ningxia, China
    • Price Inquiry: sales2@liwei-chem.com
    • Manufacturer: Anhui Liwei Chemical Co., Limited.
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    Specifications
    HS Code 423226
    Product Name TAFMER PN Series EVA Modification Film
    Manufacturer Mitsui Chemicals
    Series PN Series
    Product Type EVA Modification Film Modifier
    Chemical Composition Ethylene-alpha-olefin copolymer
    Form Pellets
    Density 0.870 g/cm³
    Melt Flow Rate 3.0-8.0 g/10 min (190°C, 2.16 kg)
    Melting Point 55-65°C
    Vicat Softening Point 40-50°C
    Shore A Hardness 65-75
    Tensile Strength 10-12 MPa
    Elongation At Break >1000%
    Brittleness Temperature < -70°C
    Volume Resistivity >10^16 Ω·cm
    Dielectric Constant 2.3
    Application EVA film modification for solar cell encapsulants
    Packaging 25 kg bags
    Storage Conditions Cool, dry, avoid direct sunlight
    Shelf Life 12 months

    As an accredited TAFMER PN Series EVA Modification Film factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

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    Application of TAFMER PN Series EVA Modification Film

    Why the IEC 61215 Wet Leakage Test Drives EVA/PN Blend Reformulation

    Because photovoltaic encapsulant films must retain wet leakage resistance after 1000 h of 85 °C/85 % RH damp heat and maintain luminous transmittance above 90 % when measured by ASTM D1003-21, EVA encapsulant compounders replace part of the ethylene-vinyl acetate resin with TAFMER PN propylene-based elastomer. The PN segment shifts the high-temperature creep threshold upward relative to unmodified EVA while the vinyl-functional silane coupling agent remains able to bond to glass and backsheet surfaces after lamination. Industrial compounding records from photovoltaic film lines position PN at 5 wt% to 20 wt% of total polymer mass; below 5 wt% the creep resistance gain is statistically negligible, and above 20 wt% optical haze increases beyond the 3 % delta that high-transparency encapsulant specifications typically reject. The compound contains EVA resin with vinyl acetate content between 28 wt% and 33 wt%, 0.6–1.2 phr organic peroxide, 0.3–1.0 phr vinyl-functional silane, and 0.1–0.3 phr hindered amine light stabilizer. Compounding is performed on a co-rotating twin-screw extruder with 40:1 L/D, barrel temperatures of 80–100 °C, screw speed below 300 rpm, and pelletizer water temperature below 10 °C to avoid peroxide pre-scorch. Because PN pellets have lower bulk density than EVA pellets, gravimetric feeder accuracy must be maintained within ±0.5 wt% to prevent melt flow fluctuation. Cast film extrusion then runs through a flat die at 100–110 °C onto a polished chill roll at 15–25 °C, producing 0.45–0.60 mm sheet. During module lamination the film is cured at 145–155 °C for 12–18 min under vacuum; PN additions above 10 wt% can lower final gel content by 5–10 percentage points at equal peroxide loading when tested by ASTM D2765-16. Volume resistivity measured by ASTM D257-14 must remain above 1×10^14 Ω·cm before damp-heat exposure; a drop below this threshold correlates with elevated leakage current in the IEC 61215-1:2021 wet leakage procedure. Terminal product types include monofacial and bifacial photovoltaic encapsulant sheets, transparent backside encapsulation films, and glass-glass module interlayer films that require sustained adhesion without an opaque backsheet.

    When Melt Fracture at Blow-up Ratios Above 2.6 Reduces Greenhouse Film Transparency

    On commercial three-layer blown-film lines running EVA/PN greenhouse covers, bubble stability at blow-up ratios above 2.6:1 becomes the controlling process constraint because TAFMER PN increases low-shear melt elasticity in EVA and promotes sharkskin on the inner bubble surface. Compliance for agricultural cladding requires conformance to EN 13206:2017 covering film requirements, tensile property evaluation by ISO 527-3:2018, tear resistance by ISO 6383-2:1983, and haze measurement by ASTM D1003-21. Typical formulation for a 150–200 µm greenhouse film uses EVA resin with 14–18 wt% vinyl acetate, TAFMER PN at 5–15 wt% of total polymer mass, 0.2–0.6 wt% HALS stabilizer, 0.1–0.3 wt% anti-fog surfactant, and 0.05–0.15 wt% antiblocking silica. Extrusion is performed on a single-screw extruder with 30:1 L/D and a die gap of 1.8–2.4 mm; melt temperature is held at 190–210 °C, and the frost line is set at 6–8 die diameters above the air ring. PN content must not be raised above 15 wt% without reducing blow-up ratio to 2.0:1 or increasing die gap to 2.6 mm, otherwise the film displays unacceptable gauge scatter and visible melt fracture bands at the haul-off. The propylene-based modifier contributes to fold-point tear resistance and low-temperature flexibility, while the EVA matrix retains the infrared retention and anti-fog surface performance required for protected horticulture. Terminal product types include multi-season greenhouse covers, low-tunnel films, sidewall and canopy curtains for horticulture, and thermal screens where tear resistance at repeated fold points determines service life.

    In low-temperature food contact films, the seal layer is compounded with TAFMER PN to shift the dart impact transition below -40 °C while avoiding the low-melting seal initiation penalty that limits conventional EVA sealants. The PN-modified seal layer is typically coextruded between a polyolefin core and an outer HDPE or LLDPE skin; PN dosage in the EVA seal layer is held at 10–25 wt% of the layer polymer mass. Regulatory compliance for the final structure is governed by FDA 21 CFR 177.1350 for ethylene-vinyl acetate copolymers and FDA 21 CFR 177.1520 for olefin polymers, with overall migration limits under EU 10/2011 verified on the finished film. Processing on a three-layer blown-film line requires melt temperatures of 180–230 °C, a die gap of 1.2–2.0 mm, and a blow-up ratio of 2.2:1–2.8:1; seal initiation temperature increases by approximately 5–8 K at 20 wt% PN, requiring seal bar temperatures of 125–145 °C on horizontal form-fill-seal equipment. Dart impact strength is measured by ASTM D1709-16a Method A and seal strength by ASTM F88/F88M-21; the PN-modified seal layer retains sealant integrity after deep-freeze storage at -35 °C to -45 °C. Terminal finished products include frozen vegetable pouches, ice cream bags, cold-chain seafood packaging, and peelable lid sealant layers that must avoid seal failure during high-speed filling.

    The dielectric loss factor of EVA is reduced when TAFMER PN replaces part of the vinyl acetate-rich phase, and this creates a measurable process boundary for radio-frequency welding at 27.12 MHz. High-frequency welded technical films use EVA/PN blends in the 250–500 µm thickness range; PN addition is limited to 5–12 wt% of the polymer matrix because higher levels dilute the dipolar vinyl acetate groups and reduce heat generation under the RF electrode. Weld seam peel strength is evaluated on production-calibrated RF presses with output power of 8–15 kW, electrode pressure of 0.3–0.6 MPa, and weld dwell of 2–5 s; at 15 wt% PN, line operators record a 10–15 % increase in required anode current to maintain equivalent seam temperature, and cold peel load measured by ISO 527-3:2018 drops below the specified minimum. The film is produced by calendar or cast extrusion at melt temperatures of 150–190 °C, with surface corona treatment to 38–42 mN/m before welding. Terminal products include liquid containment bladders, cleanroom curtains, and inflatable industrial structures where RF-welded seam integrity is the critical acceptance criterion. Published data for this specific PN-modified EVA configuration is limited; OEM validation on the installed RF press remains mandatory before series production.

    Hot-Melt Lamination Viscosity and the 130°C Sag Limit

    Cast extrusion of EVA/PN hot-melt film for automotive interior lamination is specified around the upper service temperature of the laminated assembly rather than the seal strength of the film alone. PN additions of 10–25 wt% in EVA raise the softening point of the adhesive layer by 5–10 K, allowing laminated PVC skins on ABS or polypropylene carriers to resist sag at 130 °C during instrument panel sunlight soak testing. Compliance requirements include VDA 277 for total VOC emissions, VDA 278 for fogging, and FMVSS 302 flame spread rate. The film is manufactured by slot-die cast extrusion at 140–170 °C and wound in 30–80 µm thickness; lamination is conducted in a flat-bed press at 120–150 °C, 0.3–0.6 MPa pressure, and 30–60 s dwell. The addition of PN lowers cold flow of the adhesive and reduces edge squeeze-out during die-cutting; it also narrows the thermoforming window when the film must follow deep-draw contours, so PN content is typically kept below 20 wt% for high-gloss PVC surfaces. Terminal finished product types include door panel skin lamination films, instrument panel coverstock adhesives, seat back laminate films, and headliner scrim-foam tie layers.

    Thermal Creep in Aluminium Profile Protective Films Is Reduced by Propylene-Based Elastomer Addition

    Surface protection of anodized and powder-coated aluminium profiles requires an EVA adhesive layer that does not transfer residue when the profile is exposed to 80 °C in warehouse or transport conditions. TAFMER PN is incorporated into the EVA adhesive layer at 10–20 wt% to shift the creep compliance of the film during short-term thermal exposure. Peel adhesion is measured by ASTM D3330-20, tensile properties by ASTM D882-18, and the architectural coating interface is specified under Qualicoat:2017 for powder-coated aluminium. The protective film is produced by cast coextrusion with a total thickness of 60–100 µm, using an EVA/PN adhesive layer on a polyethylene or polypropylene carrier; lamination onto the aluminium profile occurs at 60–90 °C nip temperature followed by immediate air cooling at 15–25 °C. PN addition above 20 wt% reduces initial peel force below the handling minimum, while addition below 10 wt% leaves adhesive transfer defects on dark colours. Terminal finished products include protective films for anodized window profiles, powder-coated curtain wall mullions, and aluminium door frame extrusions.

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    Certification & Compliance
    More Introduction

    TAFMER PN Series EVA Modification Film is supplied as a film-grade ethylene/α-olefin polymeric modifier for melt-blending with ethylene-vinyl acetate encapsulant films. The product family is differentiated by melt mass-flow rate, density, and Shore hardness rather than by vinyl acetate content. Commercial designations encountered in converting documentation include PN-2070 and PN-0040; the numerical suffix is a flow indicator and does not encode comonomer ratio, so the producer’s certificate of analysis remains the authoritative source for lot-specific properties. Material acceptance testing is normally performed according to ISO 1133-1:2022 for melt mass-flow rate at 190°C and 2.16 kg, ISO 1183-1:2019 for density, and ISO 868:2003 or ASTM D2240-15 for Shore hardness. Because the PN backbone contains no hydrolyzable ester side groups, the material does not generate acetic acid by deacetylation during film extrusion or long-term damp heat exposure.

    During film converting, the PN modifier is metered at 5–15 wt% into the EVA feed stream using a gravimetric feeder and compounded in a co-rotating twin-screw extruder with L/D 40:1 and vacuum devolatilisation at −0.08 MPa. Melt temperature is held between 160°C and 220°C to limit deacetylation of the EVA phase. The resulting blend exhibits a dispersed polyolefin phase within the EVA matrix; domain size depends on screw speed, melt temperature, and interfacial tension. On a cast film line with a chilled roll set at 15–25°C, the modified film shows improved gauge stability at thicknesses below 0.45 mm and reduced edge pin-holing. Pre-drying of EVA is required at 55–65°C for 4–6 h when storage relative humidity exceeds 60%; PN pellets should be dried under similar conditions after condensation has occurred.

    Why does the PN series suppress acetic acid effusion more effectively than metallocene polyolefin elastomers?

    Acetic acid generation in EVA encapsulant films is a hydrolytic reaction of pendant acetate ester groups, catalysed by residual acid species and accelerated by moisture ingress at 85°C and 85% RH. A saturated ethylene/α-olefin modifier without ester functionality cannot undergo deacetylation; therefore, dilution of the EVA phase with the PN series lowers the total acetate group concentration per unit film mass. This reduction is not linear at low addition levels. Below 5 wt%, the modifier phase is insufficiently percolated to interrupt acetic acid diffusion from the matrix, and the acid-catalysed autocatalytic sequence continues. Between 5 wt% and 15 wt%, the dispersed domains create longer tortuous diffusion paths for water and acetic acid, and the film exhibits measurable reductions in effusion as determined by ion chromatography of condensed volatiles after damp heat ageing per IEC 61215-1:2021. Above 20 wt%, radical cure density declines because the saturated modifier phase does not participate in peroxide crosslinking; gel content measured by xylene extraction decreases, and the film can exhibit creep at module operating temperatures.

    The contrast with metallocene polyolefin elastomers is primarily in molecular architecture and interaction with EVA. Metallocene POE has very low polydispersity and is largely incompatible with high-VA EVA at high addition levels; the result is coarse phase separation, lower blend clarity, and delamination at the glass interface if adhesion promoter concentration is not increased. The PN series is formulated for closer refractive index and rheological compatibility with EVA; haze measured by ISO 13468-1:2019 is therefore less affected at equivalent addition. The difference is observable in coextruded multilayer encapsulant films where the PN grade is used as a skin layer to improve backsheet adhesion without sacrificing total luminous transmittance. Published data for torque displacement and melt fracture thresholds at full-scale extrusion of EVA/PN blends is limited; therefore, line qualification trials are recommended before fixed replacement ratios are adopted.

    Damp Heat Ageing and Interfacial Adhesion Boundaries in Encapsulant Films

    Qualification of an EVA/PN modification film for photovoltaic encapsulation requires damp heat exposure in accordance with IEC 61215-1:2021, typically 1000 h at 85°C and 85% RH, with periodic measurement of adhesion to glass and backsheet. Adhesion is measured by 180° peel using a universal testing machine with a 20 N load cell and a peel rate of 100 mm/min; specimens are preconditioned for 24 h at 23°C and 50% RH. The PN modifier does not replace silane adhesion promoters; instead, it changes the cohesive strength of the film and the diffusion rate of adhesion promoter to the glass surface. In high-humidity processing environments, condensed moisture on pellet surfaces can introduce hydrolytic defects at the EVA/PN interface; therefore, a desiccant dryer or heated hopper is required above 60% RH.

    On blown film lines, the die gap is typically set to 0.8–1.5 mm and the blow-up ratio maintained between 2.0:1 and 3.0:1 to keep film flatness. The PN-modified EVA film exhibits lower melt extensibility than unmodified EVA at low melt temperatures; die-lip build-up can occur if the lip temperature falls below 180°C. Frost-line height must be stabilised to avoid orientation-induced birefringence that changes optical haze. In cast film production, edge trim regrind can be incorporated back into the EVA/PN blend up to 10 wt% without altering gel content, provided the regrind is dried and free from paper fibre contamination.

    Property or characteristic Reference test standard
    Melt mass-flow rate ISO 1133-1:2022 / ASTM D1238-20 at 190°C, 2.16 kg
    Density ISO 1183-1:2019 / ASTM D1505-18
    Shore hardness ISO 868:2003 / ASTM D2240-15
    Tensile strength at break ISO 527-2:2012 / ASTM D638-14
    Thin-film tear resistance ISO 6383-2:1983 / ASTM D1922-23
    Total luminous transmittance and haze ISO 13468-1:2019 / ASTM D1003-21
    Yellowing index during damp heat ASTM E313-20
    Volume resistivity IEC 62631-3-1:2023 / ASTM D257-14

    Comparative substitution of the PN series for conventional low-density polyethylene or maleic anhydride-grafted polyolefins in EVA encapsulant films introduces specific processing constraints. Unlike LDPE, the PN series has higher molecular weight and narrower melting range; therefore, screw torque can increase when a 1:1 replacement is made without adjusting barrel temperature. Unlike maleic anhydride-grafted polymers, the PN series does not introduce free acid groups that can corrode copper modules during damp heat; however, it also does not provide the same level of anhydride-mediated adhesion to polyvinyl fluoride backsheet. The choice of modifier therefore depends on whether acetic acid suppression or initial backsheet adhesion is the dominant requirement. In markets where long-term solder ribbon corrosion is a failure mode, the PN series is preferentially evaluated with adhesion promoters to balance interfacial bond strength and acid effusion.

    Regulatory compliance for photovoltaic encapsulant films requires verification against RoHS Directive 2011/65/EU for lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE; REACH Regulation (EC) No 1907/2006 for substances of very high concern; and FDA 21 CFR 177.1520 for incidental food-contact applications where the film is used as a laminate interlayer. The saturated hydrocarbon structure of the PN series does not contain halogens, phthalates, or metal oxides; certificates of analysis should confirm that the grade has not been contaminated during shipping. Unlike ionomers, which require neutralization with sodium or zinc and can cause glass corrosion under moisture, the PN series is non-ionic and does not carry metal carboxylate functionality.

    The operational boundary for EVA/PN modified film is defined by three variables: the vinyl acetate content of the host EVA, the peroxide formulation, and the silane adhesion promoter loading. With 28–33 wt% VA encapsulant EVA, the modifier reduces acetic acid diffusion but also reduces crosslinkable ester density. The resulting transmittance and adhesion balance must be re-validated for each laminate configuration because backsheet chemistry changes the interfacial diffusion of silane coupling agents. In multi-layer coextrusion, the PN-modified layer is typically placed away from the glass interface when maximum adhesion to glass is required, but adjacent to the backsheet when corrosion resistance of the metallization layer is the controlling specification. On full-scale production lines, failure modes include edge deamination after 2000 h damp heat when the modifier content exceeds the crosslink density compensation limit, and interlayer void formation at low melt temperature when the die-lip temperature is not held above 180°C. The modification film is therefore not a direct drop-in replacement for EVA; it is a formulation-bound modifier requiring co-optimisation of cure package, adhesion promoter, and extrusion thermal profile.