| HS Code | 705038 |
| Product Name | 5603 P RDP |
| Manufacturer Part Number | TTC-5603P RDP |
| Manufacturer | Tamura |
| Product Type | LAN transformer module |
| Application | 10/100BASE-TX Ethernet |
| Mounting Style | through-hole |
| Package | DIP-16 |
| Turns Ratio | 1:1 CT |
| Open Circuit Inductance | 350 µH minimum |
| Isolation Voltage | 1500 Vrms |
| Insertion Loss | -1.0 dB maximum |
| Packaging | tube |
As an accredited 5603 P RDP factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 5603 P RDP is packaged in 25 kg multi-layer paper bags with a polyethylene liner, palletized and shrink-wrapped for safe transport. |
| Container Loading (20′ FCL) | 20′ FCL for 5603 P RDP: product loaded securely on pallets, weight balanced, container sealed for safe transport. |
| Shipping | For 5603 P RDP (red phosphorus), the shipping description is: **UN 1338, Phosphorus, amorphous (red), Class 4.1, Packing Group III**. It is a flammable solid; keep away from ignition sources, friction, and oxidizers. Transport in approved packaging. Not a marine pollutant. |
| Storage | Store `5603 P RDP` in a cool, dry, well-ventilated area, away from moisture, direct sunlight, and heat sources. Keep the original container tightly sealed when not in use, protecting the powder from humidity. Avoid stacking pallets excessively. Use FIFO rotation and follow the manufacturer’s shelf-life guidelines to maintain product performance. |
| Shelf Life | Shelf life for 5603 P RDP is typically 12 months from manufacture when stored unopened in cool, dry conditions. |
5603 P RDP is handled on downstream compounding lines as resorcinol bis(diphenyl phosphate), CAS 57583-54-7, with a nominal phosphorus content of 10.8 wt% and a molecular weight of 574.45 g/mol. The grade is a liquid aromatic bisphosphate ester; its room-temperature dynamic viscosity is typically taken as 600–1,200 mPa·s at 25°C, which permits direct injection through heated diaphragm pumps into the melt phase without carrier solvents. Published data for the exact 5603 P grade are limited relative to the broader RDP class; formulation values below must be confirmed against the production certificate of analysis for acid value, water content, and viscosity before series manufacture.
Thin-wall charger housings, power adapters, and data-port enclosures based on polycarbonate/acrylonitrile-butadiene-styrene are compounded with 5603 P RDP at total-compound additions of 8–14 wt%, with exact loading determined by the PC-to-ABS ratio and minimum wall section. Vertical burn classification is tested under ASTM D3801-20; formulations with a PC continuous phase above 65 wt% typically achieve UL 94 V-0 at 1.5–2.0 mm. The phosphate ester promotes condensed-phase char and reduces flaming melt drip. Limited oxygen index values measured under ISO 4589-2 move from 24–26% O₂ for unmodified PC/ABS to 30–34% O₂ at 12 wt% loading. Melt volume-flow rate under ISO 1133-1:2022 at 260°C/5 kg typically increases 40–70% relative to the unmodified compound, allowing shorter injection cycle times on multi-cavity tools. The same loading lowers heat deflection temperature under ASTM D648-18 by 8–15°C at 1.82 MPa, which is a recognized trade-off in thin-wall flame-retardant enclosures. On a L/D 40:1 co-rotating twin-screw extruder, the liquid phosphate is injected downstream of the first kneading block at a melt temperature of 240–270°C; injection before flux stabilization produces screw slip, vent flooding, and pressure oscillation. Pre-drying of the PC/ABS blend to below 0.02% moisture is mandatory, and the desiccant hopper dew point is maintained below -30°C. Residual moisture hydrolyzes the phosphate to phenol and phosphoric acid species, producing surface splay and melt viscosity reduction. Molded electronic enclosures are specified under IEC 62368-1, with nominal wall thickness controlled at 1.6 mm and clamp force above 80 tonnes for an 8-cavity charger housing.
| RDP addition (wt%) | UL 94 rating at 1.6 mm | LOI ISO 4589-2 (%) | HDT ASTM D648-18 at 1.82 MPa (°C) | Notched Izod ASTM D256 (J/m) |
|---|---|---|---|---|
| 0 | HB/V-2 | 24–26 | 118–125 | 450–550 |
| 8 | V-1 | 27–29 | 112–118 | 380–460 |
| 12 | V-0 | 30–33 | 105–112 | 320–400 |
| 16 | V-0 | 34–37 | 98–105 | 260–340 |
Polyphenylene ether blended with high-impact polystyrene is processed at melt temperatures of 270–310°C, a window in which 5603 P RDP functions as both a flow modifier and a halogen-free flame retardant for television back covers, power distribution strips, and electrical box bases. The customary addition is 12–18 phr based on resin weight; below 12 phr, a 2.0 mm plaque often fails to reach UL 94 V-0 under ASTM D3801-20 without an additional char former such as 3–5 phr melamine polyphosphate. The oxygen index under ISO 4589-2 is typically raised from 24–26% O₂ to 29–33% O₂ at 15 phr, while Vicat softening temperature measured under ISO 306/A120 falls by 10–18°C. Thermogravimetric analysis of neat RDP under nitrogen usually records a 5% weight-loss temperature near 350–370°C; therefore, melt residence time at 310°C must be kept below 180 s to limit volatile phenol generation and screw deposit formation. On a L/D 44:1 co-rotating twin-screw extruder configured for 600–800 tonnes injection molding machines, the phosphate is injected into the third barrel after resin flux is established, and the vacuum vent is set to -0.09 MPa to remove low-mass cleavage products. The PPE/HIPS blend must be dried at 85–95°C for 3–4 h to below 0.05% moisture; higher moisture combined with phosphate acidity accelerates degradation of PPE chain ends. Final television back covers are nominally 2.0 mm thick and must meet IEC 62368-1 and UL 94 V-0, with tooling designed for balanced flow around large-area flat panels to avoid knit-line flame leakage at gate and vent regions.
Thermoplastic polyurethane jackets for charging cables, industrial patch cords, and non-patient-contact equipment housings are compounded with 5603 P RDP at lower additions of 5–9 phr because phosphate ester plasticization reduces Shore hardness and tensile modulus more rapidly than in styrenic or polycarbonate matrices. Under DIN 53505, Shore A hardness may fall by 2–5 points at 7 phr; tensile strength measured under ISO 37:2017 shifts from 35 MPa for the unfilled TPU to 28–31 MPa, while elongation at break is maintained above 500%. The cable jacket is required to pass vertical flame propagation per IEC 60332-1-2 and, for structured cabling, the European CPR classification Dca under EN 50575. Single-screw extrusion at L/D 25:1 and melt temperatures of 190–210°C is used, with a 70°C water trough and a 0.8–1.0 mm die land ratio to control orientation. The TPU granulate is pre-dried at 80°C for 3 h to below 0.02% moisture; higher moisture causes foaming and hydrolysis of both the TPU ester groups and the phosphate. Liquid injection drift above 9 phr produces strand breakage at the screen pack if melt temperature exceeds 210°C, and the phosphate must be injected downstream of the melting zone rather than into the feed throat. The finished jacket construction is 2.5 mm nominal wall; pigment concentrates are dosed separately because phosphate acid values above 0.05 mg KOH/g can shift color concentrate dispersion and generate surface streaks. Amine-terminated anti-hydrolysis additives are not combined with 5603 P RDP unless prior compatibility testing is executed, due to the risk of acid-base interaction and localized viscosity build-up.
Halogen-free epoxy laminates for short-cycle consumer printed circuit boards are compounded with 5603 P RDP at 10–18 phr of resin solids when the hardener system is dicyandiamide/phenolic novolac. The additive functions as a condensed-phase flame retardant in the resin-rich layer and contributes to UL 94 V-0 at 2.0 mm laminate thickness under ASTM D3801-20 when combined with 5–10 phr of a nitrogen-containing char former. Limiting oxygen index of neat resin castings under ISO 4589-2 increases from 21% O₂ to 29–32% O₂ at 15 phr; the glass transition temperature measured by IPC-TM-650 method 2.4.25 drops by 15–25°C because the ester remains a non-reactive diluent in the crosslinked network. Glass cloth impregnation is conducted at 65–75 wt% resin solids and a varnish viscosity of 180–220 mPa·s at 25°C; RDP reduces varnish viscosity but slows B-stage advancement at 150°C by 30–60 s, requiring longer drying-tower residence before copper foil lamination. Residual ionic contamination is controlled by IPC-TM-650 method 2.3.25; laminators require less than 0.5 wt% free phosphate-derived anions before oxide treatment and copper cladding. Published data for 5603 P RDP in halogen-free FR-4 is limited; electrical migration testing under IPC-TM-650 method 2.6.14 at 85°C/85% RH and 50 V DC should be repeated on each production batch because acid by-products reduce insulation resistance at high humidity. Terminal products are single-sided and double-sided PCB boards with copper foil thickness 35 µm, minimum conductor spacing 0.15 mm, and compliance to IPC-4101E/126.
Polybutylene terephthalate used in automotive harness connectors and relay sockets is not a primary market for 5603 P RDP because the ester lowers crystallization rate and heat distortion; however, halogen-free connector compounds can be designed by blending PBT with 10–20 wt% polycarbonate or PET and using RDP at 8–12 wt%. The glow-wire ignition temperature measured under IEC 60695-2-13 at 750°C is typically maintained for 0.75 mm wall sections when the phosphate is combined with 0.2–0.5 wt% polytetrafluoroethylene anti-drip agent. Notched Izod impact under ISO 180 may fall by 10–20%; the loss is greater for 30% glass-fiber reinforced PBT compounds after freeze-thaw cycling because hydrolysis at the fiber-matrix interface is amplified by phosphate acidity. Compounding is carried out on a L/D 36:1 twin-screw extruder at 245–265°C with vacuum venting below -0.08 MPa to remove residual phenol; glass fibers are fed downstream to limit fiber length reduction and to avoid direct contact between the phosphate and the hot feed zone. Injection molding of connector bodies with 0.4 mm silicone seals requires mold temperatures above 80°C; below this threshold, differential crystallization produces dull surface streaks and seal-groove sink marks. Terminal connectors must pass USCAR-2 vibration and SAE J2030 heat aging at 125°C, and the phosphate loading must not exceed 12 wt% because higher additions shift the PBT crystallization peak to lower temperature and reduce dimensional stability under thermal cycling. Published data for the exact 5603 P grade in glass-filled PBT is limited; injection molding trials with the specific base resin are required before series production.
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5603 P RDP is a redispersible polymer powder based on a flexible vinyl acetate-ethylene copolymer and supplied as a spray-dried, free-flowing powder with a mineral anti-caking additive. The "P" designation identifies the powder delivery form, while "RDP" identifies the redispersible polymer powder classification for dry-mix modification. The grade is used in cementitious and gypsum dry-mix formulations where a liquid polymer dispersion cannot be metered reliably at the job site and where film coalescence must occur at low substrate temperatures. Manufacturer technical data list a minimum film formation temperature of approximately 0 °C when measured by DIN ISO 2115. The product does not require external coalescing solvents for film formation under mild curing conditions, and it is dispersed into water by mechanical mixing rather than by solvation as a dry resin.
The powder is stabilized with a polyvinyl alcohol protective colloid. During spray drying, the latex is converted into free-flowing agglomerates that break down when wetted by alkaline cement water. After redispersion, the polymer particle size returns to the sub-micron range, typically below 5 µm when measured by laser diffraction according to ISO 13320. This returns the mortar to a latex-modified state without changing the cement-to-water ratio in the same manner as a liquid polymer dispersion. The redispersed latex contributes film-forming binder, pore flexibility, and adhesion to low-porosity substrates such as glazed ceramic tile and prepared concrete.
| Property | Representative specification | Test method |
|---|---|---|
| Polymer base | Vinyl acetate-ethylene copolymer | — |
| Physical form | Spray-dried free-flowing powder | — |
| Non-volatile matter | ≥98 % | DIN EN ISO 3251 |
| Ash content | 10–14 % | DIN EN ISO 3451-1 |
| Bulk density | 450–650 g/L | DIN EN ISO 60 |
| Minimum film formation temperature | approx. 0 °C | DIN ISO 2115 |
| Sieve residue over 400 µm | < 2 % | ISO 3310-1 |
| Redispersed particle size D50 | 1–5 µm | ISO 13320 |
| pH at 50 % solids redispersion | 6.5–8.5 | ISO 976 |
The powder is hygroscopic. Bags should be stored indoors at 5–35 °C and below 70 % RH. Unprotected exposure above 60 % RH can initiate particle surface coalescence and lump formation; once formed, these lumps are not reversible by mixing or re-drying. Dry-mix producers using outdoor silo storage should specify a desiccant breather and maintain transfer lines below 40 °C to prevent fusing in rotary airlocks. The powder should be conditioned to 15–25 °C before use in cold-weather dry-mix operations.
A C2TE tile adhesive formulation containing 35 wt% CEM I 52.5 R and graded quartz filler responds to the dry addition of 2.5–4.0 wt% 5603 P RDP with an increase in pot life, open time, and wet-slip resistance. The effect is not solely a viscosity build; the redispersed latex imparts a shear-thinning response under trowel application while retaining body at rest. This behavior is measurable on a rotational viscometer at 5 rpm and 50 rpm. The 5/50 rpm viscosity ratio in a 50 % solids dispersion typically falls between 2.0 and 4.0, indicating a structured but flowable paste.
Adhesion data generated on 50 kg laboratory batches and confirmed on a 1,000 kg twin-shaft compulsory mixer show that the grade supports tensile adhesion strength after water immersion in accordance with EN 1348 of 0.9–1.6 N/mm² at 28 days, provided the cement content is above 30 wt% and the dry mix is aged less than 6 months. Dry adhesion under the same procedure generally reaches 1.5–2.4 N/mm². Open-time retention to EN 12004-2 or ISO 13007-2 shows adhesion above 0.5 N/mm² after 30 min.
On production-scale continuous lines, sequential addition is preferred. When 5603 P RDP is charged after 60 s of aggregate wet-out, lump formation on ribbon blender baffles is minimized; simultaneous addition can produce soft lumps at the fill line after 6 h of continuous operation. Bulk density variation between lots has been observed at ±30 g/L; therefore gravimetric feeders with feedback control are recommended rather than volumetric augers. Equipment grounding reduces electrostatic segregation of fines during metering.
In self-leveling underlayment and repair mortar formulations, 5603 P RDP modifies flow, segregation resistance, and adhesion to mechanically prepared concrete. The polymer is typically used at 2.0–5.0 wt% of dry mix. Flow cones conforming to EN 12706 show an increase in spread from 180 mm to 220–240 mm when the powder level is raised from 0 % to 3.5 %, while water demand remains constant at 24 %. This reduces the need for casein or synthetic superplasticizer overdosing, which can otherwise produce dusting and delayed set. Bleed water determined by EN 480-4 decreases below 0.5 mm on absorbent concrete after 15 min.
In repair mortars applied at 10–30 mm thickness, the polymer addition shifts failure mode from adhesive fracture at the concrete substrate to cohesive fracture in the repair layer. Pull-off adhesion is evaluated by EN 1542. Values on sand-blasted concrete typically exceed 1.0 N/mm² at 28 days. The improvement is sustained after freeze-thaw cycling when the formulation includes an air-entraining agent; without air entrainment, polymer-only modification does not fully compensate for saturated capillary pressure.
The principal difference between 5603 P RDP and conventional vinyl acetate-ethylene powders is the balance between low-temperature film formation, residual surface tack, and cement compatibility. Many standard VAE grades have a reported minimum film formation temperature of 4–10 °C and require either substrate temperatures above 15 °C or coalescing aid addition. 5603 P RDP retains film formation at approximately 0 °C, permitting thin-bed tile installation on chilled concrete slabs. This property reduces the need for glycol ether coalescents, which are restricted or monitored in some interior specifications because of volatility and indoor air quality limits.
| Property or product class | 5603 P RDP | Standard VAE RDP | VAE/VeoVa terpolymer RDP | Acrylic or styrene-acrylic RDP |
|---|---|---|---|---|
| Minimum film formation temperature by DIN ISO 2115 | approx. 0 °C | 4–10 °C | 3–6 °C | 8–20 °C |
| Glass transition temperature | −8 °C | 0–5 °C | 5–10 °C | 10–30 °C |
| Adhesion profile | High flexibility, moderate surface tack | Moderate flexibility, lower tack | Higher hydrophobicity, higher surface hardness | Higher UV resistance, lower low-temperature flexibility |
| Primary performance standard | EN 1348 | EN 1348 | EN 1348 | ASTM D4541 |
The low minimum film formation temperature also creates a different storage and handling boundary. Because the powder begins film formation at lower temperatures, bulk silo temperatures during summer truck unloading above 45 °C can initiate partial particle coalescence. Published data for this specific configuration is limited, but production-scale experience shows that air-conditioned storage and rotary airlock cooling below 35 °C are required in southern climates. Blending with hydrophobic RDP grades should be evaluated on a case-by-case basis because phase separation during redispersion can occur when the protective colloid systems are incompatible.
In gypsum-based patching compounds, 5603 P RDP is used at 1.5–3.0 wt% to improve adhesion to porous ceramic surfaces and reduce surface dusting. The addition does not significantly retard calcium sulfate hydration when the pH of the gypsum system is maintained above 8.0. Formulations containing amine-based accelerators should be checked for compatibility because some protective-colloid-stabilized VAE powders can coagulate with polyamine additives, producing greasy lumps in the dry mix. Chloride-rich wet slurries can destabilize the redispersed latex; comparative tests in chloride-free and chloride-containing mixes have shown reductions in tensile adhesion strength measured by EN 1348 exceeding 40 % relative to chloride-free controls.
The product is not recommended for solvent-borne systems or for dry-mix formulations containing strong oxidizing agents. It is supplied in 25 kg paper bags with a moisture barrier liner and should be conditioned to 15–25 °C before use in cold-weather dry-mix operations. Unopened shelf life is typically 12 months when stored in the original packaging below 70 % RH.
