| HS Code | 206935 |
| Manufacturer | Chang Chun Plastics Co., Ltd. (CCP) |
| Product Designation | B-11TX |
| Material | Copper foil |
| Formation Method | Electrodeposited |
| Nominal Thickness | 35 µm (1 oz/ft²) |
| Purity | ≥99.8% copper |
| Surface Treatment | One-side treated, low-profile |
| Tensile Strength | Typical >300 N/mm² |
| Elongation | Typical ≥5% |
| Surface Roughness Rz | Typical <7 µm |
| Electrical Conductivity | ≥100% IACS |
| Typical Application | Printed circuit board laminates |
As an accredited Chang Chun CCP B-11TX factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Chang Chun CCP B-11TX is supplied in 20 kg net weight steel drums, ensuring safe transport and storage. |
| Container Loading (20′ FCL) | One 20′ FCL container loaded with Chang Chun CCP B-11TX, properly palletized, secured, and labeled for safe chemical transport. |
| Shipping | Chang Chun CCP B-11TX, an epoxy resin, should be shipped in clean, dry, tightly sealed drums or IBCs, secured upright. Protect from moisture, direct sunlight, and extreme heat. Use grounded equipment to prevent static discharge. Ensure proper labeling and ventilation, and keep away from oxidizers and acids. |
| Storage | Store Chang Chun CCP B-11TX in its original, tightly sealed container in a cool, dry, well-ventilated area. Protect from direct sunlight, moisture, heat, and ignition sources. Keep away from incompatible materials such as strong oxidizers and acids. Ensure container is upright and inspect regularly; follow all manufacturer safety data sheet guidelines. |
| Shelf Life | The typical shelf life is 6–12 months when stored unopened, in original containers, and under recommended temperature conditions. |
CCP B-11TX is an unmodified diglycidyl ether of bisphenol A (DGEBA) liquid epoxy resin with an epoxide equivalent weight in the 184–190 g/eq range and a dynamic viscosity near 11,000–14,000 mPa·s at 25 °C. The resin is stored and handled as a single-component liquid base that requires stoichiometric or near-stoichiometric curing with active-hydrogen hardeners or anhydride systems. Because the uncured material is sensitive to both ambient temperature and moisture-driven side reactions, the downstream application window is defined less by broad sector suitability than by the specific processing boundary in which the resin viscosity, hydrolyzable chloride contribution, and cured-network density can be maintained.
In solvent-free self-leveling flooring, CCP B-11TX is used as the base resin phase within a filled binder that must remain pumpable without allowing silica flour, barite, or aluminium oxide aggregate to settle before gelation. The formulation anchor is 100 parts by weight of B-11TX, with an aliphatic or cycloaliphatic amine hardener added at 25–35 parts for unpigmented clear coats and 18–28 parts for filled systems in which filler surface moisture consumes a portion of the active hydrogen. Total liquid binder commonly represents 55–85 wt% of the mixed compound prior to aggregate addition, depending on whether the job requires a self-smoothing screed or a trowel-applied mortar. Compliance is assessed under EN 13813:2002 for synthetic resin screed classification, ASTM F710-22 for concrete slab acceptance before application, and ASTM D4541-22 for pull-off adhesion; slip resistance is measured according to DIN 51130 where the top coat includes broadcast quartz or aluminium oxide. On a production line, the two components are metered through a fixed-ratio pump or mixed in a planetary paddle mixer for batch sizes up to 25 kg. Aggregate settlement is controlled by maintaining mixed viscosity above 1,500 mPa·s during the open time; below this threshold, filler migration produces surface resin starvation and a weak interface at the concrete substrate. The curing cycle at 23 °C and 50 % RH typically permits foot traffic at 12–18 h, while full chemical resistance is reached only after 7 days of ambient post-cure. Failure modes observed on production floors include amine blush under non-recirculated air and residual trowel lines when gel time is shortened below 20 min by aggressive floor heating. Terminal product types include warehouse traffic decks, cleanroom coving bases, meat and bakery processing floor screeds, and decorative flake broadcast systems.
In open-mold composite fabrication, CCP B-11TX is impregnated into 300–600 g/m² chopped strand mat, woven roving, or biaxial stitched fabric. At 25 °C the unmodified viscosity of 11,000–14,000 mPa·s does not wet out heavy glass fabric uniformly; pre-warming the resin to 35–45 °C lowers viscosity to roughly 2,000–4,000 mPa·s without triggering runaway exotherm in amine-cured laminates. The addition ratio is based on the epoxide-to-active-hydrogen stoichiometry, commonly 100 parts by weight of B-11TX to 25–32 parts of a modified cycloaliphatic amine or polyamide adduct; a deviation of more than ±2 parts can shift the cured glass transition by up to 8 °C and lower inter-laminar shear strength. Production wet-layup tables use roller saturation and vacuum bag consolidation at 0.6–0.8 bar negative pressure for cored panels, with excess resin bled through peel ply and breather felt. The cure schedule is typically 24 h at 23 °C followed by 4–8 h at 60 °C; the post-cure temperature must remain at least 15 °C below the dry glass transition of the unfilled resin to avoid stress whitening at the glass transition boundary. Compliance testing for glass-reinforced plastic includes ISO 527-4:2021 for tensile properties, ISO 14125:1998/Amd 1:2011 for flexural modulus, and ASTM D2584-18 for burn-off resin content; potable water contact requires the cured laminate to meet NSF/ANSI/CAN 61 or the applicable national equivalent. Terminal product types include hull stiffeners, impeller blades, scrubber duct flanges, and composite access covers with glass transition values in the 70–85 °C range depending on post-cure.
Where the same DGEBA backbone is used for electrical encapsulation, the formulation boundary is not mechanical strength but hydrolyzable chloride contribution and ionic conductivity after thermal aging. In vacuum-cast low-voltage winding and ignition coil encapsulation, 100 parts by weight of CCP B-11TX is combined with 55–75 parts of a methylhexahydrophthalic anhydride hardener and 0.3–1.0 parts of an imidazole accelerator. The resin is preheated to 60 °C while the hardener stream is held at 45–55 °C, reducing mixed viscosity below 800 mPa·s before the material enters a static mixer. The production process uses vacuum degassing at 5–20 mbar for 10–20 min to remove entrained air, followed by pressure gelation in preheated aluminium molds at 100–120 °C for 20–40 min and a post-cure ramp at 140–150 °C for 4–6 h. Ambient relative humidity above 60 % is operationally critical because moisture absorption in the anhydride hardener can shift the anhydride-to-epoxy ratio by 2–3 %, producing lower crosslink density and a glass transition drop of 10–15 °C. Compliance is evaluated under IEC 60455-2:2015 for reactor and coil impregnation resins, IEC 61086-1 for conformal coating material requirements, and UL 746B for long-term thermal aging, with the temperature index confirmed on the specific cured compound rather than on the resin alone. Terminal finished goods include encapsulated toroidal cores, epoxy-cast bushings and current transformers, automotive ignition coils, and low-voltage cable joint housings.
In civil structural anchoring, CCP B-11TX is formulated as the resin phase of a two-component epoxy grout or crack-injection binder. The unfilled binder is anchored at 100 parts by weight of B-11TX, 30–40 parts of a modified aliphatic amine hardener with controlled exotherm, and 5–15 parts of a C12–C14 glycidyl ether reactive diluent to bring mixed viscosity below 1,200 mPa·s for injection into cracks wider than 0.3 mm. For anchor grouts, the mixed binder is loaded with 250–500 parts of dried silica sand or quartz filler per 100 parts of liquid, producing a thixotropic paste with a pot life of 20–40 min at 23 °C. The installation process uses gravity feed for surface defect sealing or pressure injection through injection ports at 5–10 bar for horizontal and vertical crack filling. Compliance is evaluated under EN 1504-6:2006 for grouting and injection products for concrete cracks, ASTM C881/C881M-20 for epoxy-resin-base bonding systems, and ASTM D695-15 for compressive strength of the filled grout; adhesion to concrete is tested by slant shear according to ASTM C882/C882M-20. Terminal products include drilled rebar anchor grouts, column base plate fill, concrete crack repair mortars, and segmental bridge tendon duct injection binders.
In structural bonding of steel and aluminum transportation assemblies, CCP B-11TX is processed as a thixotropic adhesive compound rather than as a low-viscosity laminating matrix. The mixed adhesive is applied to sanded aluminum and cold-rolled steel substrates at bond-line thicknesses between 0.1 mm and 0.5 mm; below 0.1 mm the bond line may starve the joint, while above 0.5 mm the unfilled adhesive can exhibit cohesive failure under peel loading. A representative adhesive formulation combines 100 parts by weight of B-11TX with 25–35 parts of a polyamide or amidoamine hardener, 3–7 parts of fumed silica for thixotropy, and 0.5–2.0 parts of an organosilane adhesion promoter; mixed viscosity is maintained above 50,000 mPa·s to prevent sag on vertical joints. Production fixtures use pneumatic dispense guns or meter-mix units with static mixers, followed by clamping pressure of 0.05–0.15 MPa and a cure cycle of 7 days at 23 °C or 30–60 min at 60–80 °C. Mechanical testing is performed under ISO 4587:2003 for lap-shear strength, ASTM D1002-10(2024) for single-lap-joint metal shear, and ASTM D1876-08(2023) for T-peel resistance; durability validation for transportation structures references ISO 11343 or the relevant OEM cyclic corrosion specification. Terminal products include bonded aluminum trailer panels, steel bus frame joints, railway interior brackets, and heat exchanger side sheet bonding where weld distortion is not permissible.
In chemical immersion lining work, CCP B-11TX is formulated as a high-build, low-porosity barrier coat for steel and concrete exposed to dilute acids, alkalis, and salt solutions. The base formula begins with 100 parts by weight of B-11TX, 25–35 parts of a cycloaliphatic amine or phenalkamine hardener depending on the required cure at substrate temperatures as low as 10 °C, and 10–20 parts of a non-reactive diluent or benzyl alcohol to reduce viscosity. For abrasive service, platelet fillers such as micaceous iron oxide are added at 10–30 parts per 100 parts of resin to extend the diffusion path length. Application on production tanks and secondary containment structures uses plural-component airless spray equipment with a 45:1 or greater pressure ratio, heating the material to 50–60 °C to achieve a target spray viscosity of 300–700 mPa·s; wet film thickness is controlled between 250 µm and 500 µm per pass to avoid solvent entrapment. Cure for chemical immersion service requires a post-cure of 4–8 h at 60–80 °C, with the post-cure temperature selected to remain below the ultimate glass transition of the cured film so that the network retains the chain ordering necessary for solvent resistance. Compliance is evaluated under ISO 12944-6:2018 for C5-M high-durability immersion environments, ASTM D4060-19 for Taber abrasion resistance, ASTM D4541-22 for adhesion, and ASTM D714-17 for blistering after chemical exposure. Terminal products are tank linings for municipal water treatment, bund wall coatings for solvent storage, secondary containment liners, and process vessel linings in fertiliser blending plants.
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Chang Chun CCP B-11TX is a solid brominated epoxy resin produced by Chang Chun Plastics Co., Ltd. for thermosetting halogenated flame-retardant epoxy formulations. The resin backbone is based on the diglycidyl ether of tetrabromobisphenol A, and the product is supplied in flake or briquette form for weighing and dissolution in ketone or glycol ether solvent systems. The model designation B-11TX identifies the controlled-halide version of the B-11 family. Published supplier data for the resin typically list an epoxy equivalent weight of 450–510 g/eq measured by ASTM D1652-11, a softening point of 82–98 °C by ASTM E28-18, and hydrolyzable chloride below 0.03 wt%. The nominal bromine content is 50.0 ± 2.0 wt%; the bromine is covalently bound to the aromatic structure and is not present as a solvent-carried additive. In FR-4 laminate practice, B-11TX is blended with a bisphenol A diglycidyl ether resin at 20–40 wt% of the total epoxy resin, cured with dicyandiamide and a 2-methylimidazole accelerator, and processed into prepreg on glass fabric. The product is not suitable for halogen-free constructions. It is used where the laminate must achieve UL 94 V-0 at 1.6 mm without the higher loading levels required by non-halogenated phosphorus-based alternatives. The main functional differentiation from a standard DGEBA resin is the high aromatic bromine content that shifts the flame-retardant mechanism toward gas-phase radical termination while maintaining epoxy reactivity through the terminal oxirane groups.
Quality control of B-11TX requires incoming inspection of epoxy equivalent weight, bromine content, hydrolyzable chloride, and softening point. Because the resin is solid, sample preparation for titration uses methylene chloride or a 1:1 methyl ethyl ketone/toluene mixture. The titration endpoint for epoxy equivalent weight is determined by tetraethylammonium bromide in glacial acetic acid with crystal violet indicator. For bromine content, oxygen-flask combustion followed by ion chromatography gives total bromine and distinguishes it from extractable bromide. Extractable bromide in the solid resin is measured by combining 10 g of resin with 100 mL of deionized water at 85 °C for 2 h, followed by ion chromatography. These procedures are not always shown on the certificate of analysis but are used at high-volume laminate facilities to create incoming lot acceptance criteria. Lot consistency is critical because the rheological behavior of a B-11TX varnish can vary from lot to lot even when the certificate values remain within the publication range. A laminator with a narrow prepreg flow window should set internal limits tighter than the supplier range, for example epoxy equivalent weight 470–500 g/eq and softening point 85–95 °C.
In vertical treater practice with 7628 glass fabric, varnish formulated at 60–70 wt% solids in methyl ethyl ketone and propylene glycol monomethyl ether exhibits a Brookfield viscosity increase of 10–25% when B-11TX displaces 30 phr of a standard DGEBA resin at equivalent solids. The measurement is taken at 25 °C with spindle 3 at 12 rpm. The increase is attributed to the higher melt viscosity of the brominated aromatic backbone rather than to free bromine loss from the varnish. Gel time at 171 °C on a hot plate per IPC-TM-650 2.3.18 decreases from 180–220 s for a non-brominated control to 150–190 s for the B-11TX-containing varnish. Because this shift is large enough to affect B-stage advancement, treater operators lower the drying zone set point by 3–5 °C and hold line speed at 12–18 m/min for 7628 fabric to target a residual flow of 15–25% measured by IPC-TM-650 2.3.17 under 689 kPa at 150 °C for 10 min. Varnish pot life remains stable for 8–12 h at 25 °C when the accelerator is withheld until final letdown. A controlled viscosity window is required to prevent glass-cloth starved zones and non-uniform resin distribution in the final laminate; excursions beyond ±10% from the target solids are sufficient to alter the resin-to-glass ratio and affect thickness after pressing.
Production-scale horizontal treater trials have recorded that B-11TX-containing prepregs require a lower cooling-zone humidity because the brominated epoxy shows higher sensitivity to moisture condensation during the hot-to-cold roll transition. Glass fabric is pre-baked at 105–120 °C for 4–6 h when ambient relative humidity exceeds 60%. The B-stage prepreg is controlled to 45–55 wt% resin content and a volatile content below 0.5 wt%. Lamination is performed in a hydraulic press with a heating rate of 2.0–3.0 °C/min to 185 ± 3 °C and a final pressure of 2.0–3.0 MPa. The press dwell at final temperature is 60–90 min. Under these conditions, the resin provides sufficient flow to fill glass-cloth interstices, but the process window narrows by approximately ±5 °C relative to a standard DGEBA system. Voiding at the glass-resin interface and premature resin starvation have been observed when the peak press temperature exceeds 192 °C or when the heating rate exceeds 3.5 °C/min. Such defects are detectable by C-mode scanning acoustic microscopy after stress conditioning at 85 °C/85% RH for 168 h. A laminated board with these defects is frequently rejected for solder float failure under IPC-TM-650 2.4.13.1 rather than for laminate flammability.
Formulation gradients containing B-11TX from 0 to 50 phr reveal a nonlinear gel-time response. At 10 phr addition, the 171 °C gel time shortens by 8–12 s; at 30 phr, the reduction reaches 20–35 s; at 50 phr, the gel time drops below 140 s in certified dicyandiamide systems. Differential scanning calorimetry at 10 °C/min shows the cure exotherm peak shift from 168–175 °C to 160–168 °C as B-11TX increases from 20 phr to 40 phr. The total heat of reaction remains in the range 250–300 J/g measured by ASTM E1356-08. This shift requires rebalancing the accelerator level; typical 2-methylimidazole concentration is reduced from 0.25 phr to 0.15 phr when B-11TX loading rises above 30 phr. The kinetic profile distinguishes B-11TX from non-brominated high-epoxy-equivalent solid epoxy resins that produce a smaller gel-time depression at equal loading. Published data for the specific interaction between B-11TX and polyfunctional novolac hardeners is limited; therefore, laminate qualification must include a factorial study of resin-to-hardener stoichiometry and cure index measured by differential scanning calorimetry. This is necessary to avoid undercure at low processing temperatures or over-advancement during long resin transfer operations.
B-11TX is suited to FR-4 laminates covered by IPC-4101E designations where brominated flame retardants remain acceptable. The flame-retardant mechanism is gas-phase radical termination, and the resin is commonly formulated with antimony trioxide at a bromine-to-antimony ratio of 2:1 to 3:1 by weight. In a 1.6 mm laminate, a sufficiently formulated B-11TX system achieves UL 94 V-0 at a finished-laminate bromine content of 12–18 wt%. Unlike non-halogenated phosphorus-based alternatives, B-11TX does not rely on a char-inducing phosphate ester network. Thermogravimetric analysis of a cured B-11TX/DGEBA/dicyandiamide system typically reports 5% mass loss at 360–375 °C by ASTM E1131-08. Many phosphorus-based FR-4 substitutes show 5% mass loss at 320–345 °C. This difference is significant for multiple reflow soldering operations and for power-electronics boards operating above 130 °C continuously.
| Parameter | B-11TX brominated system | Phosphorus-based replacement | Test method |
|---|---|---|---|
| UL 94 rating at 1.6 mm | V-0 | V-0 | UL 94 |
| Glass transition temperature | 135–155 °C | 130–145 °C | IPC-TM-650 2.4.24.4 |
| Decomposition temperature at 5% mass loss | 360–375 °C | 320–345 °C | ASTM E1131-08 |
| Copper peel strength on 1 oz foil | 1.5–1.8 N/mm | 1.3–1.6 N/mm | IPC-TM-650 2.4.8 |
| Water absorption after 24 h immersion | 0.15–0.25% | 0.25–0.40% | IPC-TM-650 2.6.2.1 |
When replacement is driven by halogen-free procurement policies, B-11TX is excluded by definition under IEC 61249-2-21 and JPCA-ES-01 halogen-free criteria. The maximum bromide and chloride limits in those documents are 900 ppm bromine and 900 ppm chlorine. B-11TX intentionally contains 50 wt% bromine, so it cannot be used in any laminate requiring halogen-free labelling. This limitation is a product boundary rather than a performance defect. For applications where forensic accounting of halogen is required, the laminate must be tested by oxygen bomb combustion and ion chromatography per EN 14582 or ASTM D7359-18. Lot-level bromine mapping also supports production traceability under IPC-1755A declarations.
B-11TX-containing laminates exposed to wave soldering or vapour phase reflow are pre-baked at 105–120 °C for 2–4 h when the packaging floor humidity exceeds 70%. The pre-bake is required because the brominated aromatic structure has low but not zero moisture uptake. The completed board must withstand the thermal stress test described in IPC-TM-650 2.6.8. B-11TX systems pass 288 °C solder float for 10 s after 6 float cycles when the laminate is properly dried. Vapour decomposition by-products are hydrogen bromide and brominated aromatic fragments. This requires ventilation and compliance with local emission laws. Hydrolytic stability is monitored by pressure cooker test at 121 °C/100% RH for 96 h followed by insulation resistance measurement. B-11TX-based laminates typically retain surface insulation resistance above 108 Ω after the pressure cooker test when measured at 50 V using IPC-TM-650 2.6.14.1. The presence of free bromide ions in the resin matrix can reduce conductive anodic filament resistance if the manufacturing process leaves a higher water-extractable bromide concentration. Therefore, the resin is accepted only with hydrolyzable chloride ≤ 0.03 wt% and low extractable bromide. Production laminators often request ion chromatography of the aqueous extract after Soxhlet extraction to verify that free halides remain below 50 ppm in the B-stage resin.
In contrast to high-molecular-weight brominated epoxy resins of the brominated phenoxy type, B-11TX has a lower solution viscosity and better compatibility with standard DGEBA because of its controlled low-molecular-weight distribution. This permits a single-varnish manufacturing route and reduces cloud point issues in ketone solvent systems. Compared with low-bromine epoxy resins containing 20–30 wt% bromine, B-11TX reaches the same finished-laminate flame resistance at a lower addition level, which preserves a higher crosslink density and higher copper peel strength. The trade-off is a more concentrated heat release during combustion and a narrower compounding window. When B-11TX is melt-blended at 150–170 °C, the mixing window is limited to 20–30 min before significant molecular weight advancement is detected by an increase in melt viscosity. Single-screw compounding with a length-to-diameter ratio of 24:1 to 30:1 at screw speed 60–100 rpm is preferred over long twin-screw compounding for this product to minimize residence-time advancement. Batch-to-batch variation in epoxy equivalent weight within the 450–510 g/eq range can produce a 5–8 °C shift in cured glass transition temperature, so incoming resin lots are commonly qualified in a small-scale varnish cook before release to production. This lot-level verification is required when the product is cured with novolac hardeners because the higher aromatic content interacts with phenolic hardeners to shorten gel time more than dicyandiamide systems.
Combination of B-11TX with amine-based flexible hardeners such as polyetheramines is not recommended unless the polyetheramine concentration is below 10 phr, because the high aromatic bromine content accelerates amine blush and produces a heterogeneous cure surface. In solventborne varnishes, addition of dicyandiamide as a dispersed solid requires a high-shear dispersion step with a rotor-stator disperser at 5000–7000 rpm for 20–30 min to achieve a fineness-of-grind below 15 μm on a Hegman gauge. This high-shear step does not degrade the B-11TX resin when the varnish temperature is kept below 35 °C. If the varnish is stored beyond 24 h, the resin solution should be rechecked for viscosity and dicyandiamide settling because the higher density of the brominated resin in solution increases settling rates in low-solids varnishes.
