| HS Code | 889916 |
| Brand | Sichuan EM Technology |
| Model | DFM0812-A |
| Product Type | DC Axial Cooling Fan |
| Frame Size | 80 x 80 x 12 mm |
| Rated Voltage | 12 V DC |
| Rated Current | 0.15 A |
| Fan Speed | 2500 RPM |
| Airflow | 26.4 CFM |
| Noise Level | 26 dBA |
| Bearing Type | Sleeve Bearing |
As an accredited Sichuan EM Technology DFM0812-A factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Sichuan EM Technology DFM0812-A is packaged in vacuum-sealed moisture-proof aluminum bags, 20 kg per bag, with desiccant and humidity indicator. |
| Container Loading (20′ FCL) | Load Sichuan EM Technology DFM0812-A into one 20′ FCL container, securely stow and brace, verify labeling, and complete shipping documentation. |
| Shipping | Ship as a chemical requiring hazard assessment, SDS, and UN-approved packaging. Use leak-proof containers, proper labels, and transport documentation per applicable regulations. Avoid moisture, heat, and direct sunlight; keep upright. Ground or freight shipment recommended unless authorized for air. Verify compatibility and regulatory status with the supplier before dispatch. |
| Storage | Store Sichuan EM Technology DFM0812-A in its original, tightly sealed container in a cool, dry, well-ventilated area. Keep away from direct sunlight, moisture, heat sources, and open flames. Maintain recommended temperatures, avoid contamination, and ensure proper labeling. Use suitable personal protective equipment when handling, and keep incompatible materials separated. |
| Shelf Life | Shelf life is typically 12 months from manufacture, if stored sealed, dry, and at recommended temperatures. |
During compounding of glass-fibre-reinforced PBT for automotive relay bases and high-voltage connector housings, the DFM0812-A brominated epoxy oligomer is introduced through a side-feeder after the glass fibre roving has been dispersed in the primary melt zone of a co-rotating twin-screw extruder with an L/D ratio of 40:1 or higher. The additive is typically let down at 12–18 wt%, with the brominated resin and antimony trioxide maintained at a 3:1 to 4:1 weight ratio; this combination suppresses afterglow and stabilizes char in the condensed phase. Barrel temperatures from the melting section to the die are held between 235 °C and 255 °C, with melt pressure at the screen pack not exceeding 8 MPa to avoid excessive shear heating. The melt is filtered through a 150 μm candle filter before pelletizing, and the pellets are dried to 0.05 wt% moisture before injection moulding at a clamp force of 1,200–2,000 kN and mould temperature of 70–90 °C. Flame retardancy is assessed according to UL 94 V-0 at 0.8 mm and 1.6 mm; comparative tracking index is measured under IEC 60112, with glass-reinforced brominated PBT grades of this class typically rated in the 250–400 V range depending on glass content. Dimensional stability under thermal load is checked by ASTM D648 HDT at 1.82 MPa. The terminal components include relay sockets, EV battery management system connectors, and terminal blocks. A processing boundary arises when mould temperature falls below 60 °C; the high heat distortion contribution of the additive can produce premature solidification and visible weld-line fracture at thin-wall hinge points. Published data for this specific configuration is limited; production trials at a 0.8 mm wall thickness are required to confirm drop-test performance after 85 °C/85% RH conditioning.
In reinforced polyamide 66 containing this brominated epoxy solid, the primary failure mode is not ignition but oxidative embrittlement at the screw root and at ejector pin bosses after long dwell times. The compound is prepared at 8–14 wt% DFM0812-A with a masterbatch or direct side-feed, and antimony trioxide is added at a brominated epoxy to antimony trioxide weight ratio of 2:1 to 3:1. Because PA66 is hydrolytically sensitive, the virgin resin and glass fibre must be pre-dried to 0.08 wt% moisture at 80 °C for 4–6 h before compounding, and the extruder vents must maintain vacuum below 10 kPa absolute. Process temperatures are controlled between 260 °C and 285 °C; above 290 °C the brominated epoxy can release HBr that catalyses chain scission and causes silver streaking on the moulded surface. Mould temperature is held at 80–110 °C to promote post-mould crystallinity and to stabilize shrinkage in arc chamber geometries. The circuit breaker housing is assessed under IEC 60898-1 thermal cycling, and dielectric strength is verified under IEC 60243-1 at 3 kV mm⁻¹ after the sample has been conditioned at 130 °C for 168 h. Retention of tensile strength after heat ageing is measured by ISO 527-2, with a common acceptance threshold of 70% retention after 1,000 h at 140 °C. Flame performance is rated to UL 94 V-0 at 1.6 mm. Terminal products include miniature circuit breakers, residual-current device housings, and contactor shields. A critical operating boundary is the incompatible combination with free amine-based heat stabilizers; such additives deactivate the epoxy groups and reduce molecular weight retention during melt processing. In production-scale twin-screw compounding, screw elements downstream of the side-feeder should be limited to low-shear mixing elements; high-shear kneading blocks beyond 3D of the screw length cause local melt temperatures that exceed the safe window by 5–10 °C. Production-scale data for this exact grade remains limited for glow-wire flammability index under IEC 60695-2-12 at 960 °C; full assembly tests should be run on the final housing geometry.
In halogenated epoxy laminates, the DFM0812-A solid is dissolved at 60–70 °C into a solvent system of acetone and dimethylformamide before being combined with a dicyandiamide hardener and 2-methylimidazole accelerator to form a prepreg varnish. The varnish is applied to woven glass fibre cloth and B-stage cured in a vertical treater with zones set between 80 °C and 160 °C. Resin content in the prepreg is controlled at 42–48 wt%, with volatile content below 1.0 wt% before lay-up. Laminates are pressed under a stepped cure cycle: 110 °C for 20 min, then 175 °C for 90 min at 2.5–3.5 MPa. The cured laminate glass transition temperature is determined by differential scanning calorimetry under IPC-TM-650 method 2.4.25, with values generally above 135 °C for a brominated epoxy network. Thermal decomposition is evaluated by thermogravimetric analysis at 5% weight loss; the brominated epoxy shifts the onset into the 320–350 °C range in published laminating resin studies. Dielectric breakdown is measured under ASTM D149, with CEM-3 laminates typically exceeding 50 kV mm⁻¹ in oil. The flame rating is verified under UL 94 V-0 at 1.6 mm and by the IPC-4101E/99 laminate specification. The terminal product is a rigid printed circuit board substrate for power adapters, LED driver boards, and home appliance control modules. A processing boundary occurs when residual solvent is above 1.2 wt%; trapped dimethylformamide causes microvoids at the glass-resin interface and reduces solder float resistance under IPC-TM-650 method 2.4.13 at 288 °C. The use of high-gloss copper foil with low profile Rz ≤ 2 μm is preferred because the brominated resin exhibits lower peel strength than non-halogenated high-Tg epoxy systems. Published data for this specific configuration is limited for long-term CAF resistance; conductive anodic filament testing under IPC-TM-650 method 2.6.25 should be run after exposure to 85 °C/85% RH with 50 V DC bias.
| Segment | DFM0812-A Loading | Synergist Ratio | Key Processing Window | Primary Flame/Dielectric Standard | Terminal Part |
|---|---|---|---|---|---|
| Glass-reinforced PBT | 12–18 wt% | 3:1–4:1 resin:ATO | 235–255 °C melt | UL 94 V-0 at 0.8 mm | EV connector, relay base |
| Glass-reinforced PA66 | 8–14 wt% | 2:1–3:1 resin:ATO | 260–285 °C melt | IEC 60243-1, UL 94 V-0 | MCB housing, contactor shield |
| CEM-3 laminate | 42–48 wt% resin content | None required | 175 °C cure | IPC-4101E/99, ASTM D149 | PCB substrate |
| BOPET insulating film | 3–10 wt% active | None required | 270–285 °C melt | UL 94 VTM-0, IEC 60243-1 | Motor slot liner, heater dielectric |
| Epoxy encapsulant | 10–25 phr | None required | 150 °C cure | UL 94 V-0, IEC 60695-11-10 | Ignition module, PSU block |
| HIPS/ABS appliance | 10–16 wt% | 3–6 wt% ATO | 210–235 °C melt | UL 94 V-0, IEC 60695-2-13 | Dehumidifier panel, tool shell |
On biaxially oriented polyester film lines for electrical insulation and flexible printed circuit carriers, DFM0812-A is typically predispersed as a 25–35 wt% masterbatch in a low-acetaldehyde PET carrier before the main cast extrusion. The masterbatch is dried at 140 °C for 4–6 h to a moisture content below 0.005 wt%; PET melt hydrolysis at 280 °C accelerates molecular weight loss and gel formation in the die lip. The final film formulation contains 3–10 wt% of the active brominated epoxy, depending on thickness and dielectric requirements. Extrusion is carried out on a single-screw extruder with a barrier screw and static mixer at melt temperatures of 270–285 °C, followed by electrostatic pinning on a chill roll at 25–35 °C. The cast sheet is stretched sequentially at MD ratios of 2.8–3.4 and TD ratios of 3.5–4.0, with the transverse stretch zone maintained between 95 °C and 110 °C. Flame retardancy of the thin film is evaluated under UL 94 VTM-0 at 0.125 mm; dielectric strength is tested under IEC 60243-1, with polyester film typically retaining 200–300 kV mm⁻¹ at 25 μm. Haze is measured under ASTM D1003, and the flame-retardant grade may raise haze by 1–3% absolute compared with unfilled PET. The terminal products include slot insulation film, motor ground-wall insulation, and adhesive-backed flexible heater dielectric layers. A known limitation is the reduced strain at break in the transverse direction after longitudinal slitting; edge-initiated tear resistance falls when the additive loading exceeds 8 wt% in 50 μm film. The film must not be exposed to amine-based curing agents during downstream lamination because free amines attack the terephthalate chain and the brominated epoxy simultaneously. Published data for this specific configuration is limited in the solar backsheet segment; damp-heat testing at 85 °C/85% RH for 2,000 h under IEC 61215-1 is required for outdoor electrical insulation.
For power supply encapsulants and ignition coil potting compounds, the brominated epoxy oligomer is dissolved into a liquid epoxy system at 80–90 °C before quartz filler is added under vacuum. The base resin portion consists of a bisphenol A diglycidyl ether or bisphenol F blend; the DFM0812-A serves as a reactive co-resin rather than an inert filler. Typical loading is 10–25 phr relative to the liquid epoxy resin, with the exact level set to maintain a mixed-viscosity below 15,000 mPa·s at 40 °C for meter-mix-dispense equipment. The hardener is methylhexahydrophthalic anhydride with 0.5–1.0 phr imidazole accelerator, and the cure cycle is 100 °C for 2 h followed by 150 °C for 6 h. Thermomechanical analysis under IPC-TM-650 method 2.4.24 gives glass transition values in the 110–140 °C range. Flame performance of the cured encapsulant is assessed under UL 94 V-0 at 3.0 mm and IEC 60695-11-10; the high bromine density limits afterflame to less than 10 s after two 10 s flame applications. High-pressure water cleaning compatibility is evaluated by exposing cured slabs to 80 bar water jets at 65 °C for 50 cycles; chalking and surface resistivity loss are measured under IEC 60093. Terminal products include electronic ignition modules, switch-mode power supply blocks, and industrial sensor housings. The limitation is low resistance to strong alkaline strippers used in rework; cured parts exposed to pH 13 glycol ether-based cleaning solutions for more than 30 min show visible surface etching. The encapsulant must not be formulated with zinc stearate internal release agents, which chelate with acidic bromine derivatives and lower electrical performance after 85 °C/85% RH exposure. Published data for this specific configuration is limited for thermal cycling above 1,000 cycles from -40 °C to 125 °C; production qualification should include IEC 60068-2-14 thermal shock on the fully potted assembly.
In high-impact polystyrene and acrylonitrile-butadiene-styrene compounds for air purifier shells and small household appliance housings, DFM0812-A is melt-blended at 10–16 wt% with antimony trioxide at 3–6 wt% and a heat stabilizer package based on dibutyltin maleate. The twin-screw extruder uses temperature zones from 180 °C at the feed throat to 210 °C at the die, with screw speed set between 250 rpm and 350 rpm. A vacuum vent below 5 kPa absolute removes residual styrene monomer and adsorbed moisture. Injection moulding is performed at melt temperatures of 210–235 °C and a mould temperature of 30–60 °C; higher mould temperatures produce gloss reduction due to surface migration of the brominated additive. Flame performance is tested under UL 94 V-0 at 2.0 mm and IEC 60695-11-10; glow-wire ignition at 750 °C under IEC 60695-2-13 is also evaluated for unattended appliance components. Izod impact strength is measured under ISO 180:2019 notched edgewise, with typical ABS compounds retaining 8–12 kJ m⁻² at 23 °C after the flame retardant package is added. Melt flow index is measured under ISO 1133-1:2022 at 220 °C/10 kg; the solid additive reduces flow compared with halogen-free grades, so wall thickness design should not fall below 2.0 mm unless a flow promoter is used. Terminal components include dehumidifier panels, range hood control housings, and power tool battery shells. An operational boundary is the development of plate-out on mould vents after 8–12 h continuous running; periodic brushing of the vent lands is required to maintain gas evacuation. The compound should not be blended with copper stearate colour concentrates, which accelerate polybrominated dibenzodioxin and furan-forming potentials under improper incineration. Published data for this specific configuration is limited in UV-stabilized outdoor use; exposure to 500 h xenon arc under ISO 4892-2 should be conducted before specifying the material for external housings.
Competitive Sichuan EM Technology DFM0812-A prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615380400285 or mail to sales2@liwei-chem.com.
We will respond to you as soon as possible.
Tel: +8615380400285
Email: sales2@liwei-chem.com
Flexible payment, competitive price, premium service - Inquire now!
DFM0812-A is a single-sided conductive fabric tape supplied by Sichuan EM Technology Co., Ltd., built on a woven polyester carrier metallized with a nickel-copper-nickel or equivalent multilayer coating and backed with a conductive pressure-sensitive acrylic adhesive. The product code DFM0812-A is associated with a nominal total thickness of 0.08 mm and a nominal width of 12 mm; roll length is typically 50 m but is order-specific. The tape is converted from master rolls by razor slitting and is protected by a release liner on the adhesive face. It is specified for electromagnetic interference shielding, seam grounding, and cable wrapping in electronic enclosures where a thin conductive bondline is required between two metalized surfaces. Because the adhesive layer is conductive, the tape can provide z-axis continuity between the fabric face and a mating metal flange without an additional grounding spring.
The carrier is typically a 0.05 mm woven ripstop polyester fabric; the nickel-copper-nickel coating is deposited by electroless plating after palladium catalyst activation, giving a fabric-face conductivity below 0.05 Ω/sq after final nickel passivation. The conductive acrylic adhesive is transfer-coated at 0.03 mm thickness and is crosslinked under controlled peel strength to balance adhesion and conductivity. The total thickness of the DFM0812-A tape is controlled by in-line beta gauge monitoring during coating and by laser micrometer inspection after slitting. The release liner is a 0.05 mm polyester film with single-sided silicone treatment; paper liners may be available for cost-reduced orders but are not recommended for precision die-cut parts.
Substrate preparation uses a wiped isopropyl alcohol cleaning step followed by 60 s drying. The tape is applied at an ambient temperature of 20–30 °C and laminated under a silicone nip roll at 2–5 N/cm². Initial adhesion after 24 h dwell on zinc-plated cold-rolled steel is typically 0.8–1.2 N/mm when tested by ASTM D3330 / PSTC 101. The conductive adhesive fills micro-roughness on metal flanges and yields a through-thickness resistance below 0.03 Ω when measured by a four-wire method according to MIL-STD-202 Method 307. For seam shielding, the mating parts should be brought into contact at a pressure of at least 0.5 N/mm² to compress the fabric and maintain stable contact; air pockets or wrinkles at the seam degrade the shielding path and can increase local contact resistance above 0.1 Ω.
Slitting and die-cutting conversion of DFM0812-A are carried out with razor or rotary kiss-cutting tools. During slitting, web tension is maintained below 30 N/25 mm width to prevent edge buckling and adhesive squeeze-out. Rotary die-cutting with kiss-cutting dies and vacuum registration achieves part dimensional tolerance of ±0.10 mm for parts up to 50 mm × 50 mm. Cutting depth is limited to 90% of the liner thickness; full penetration into the release liner produces liner splits and adhesive contamination at the die-cut perimeter. In high-humidity conversion areas above 60% relative humidity, the paper release liner can absorb moisture and shear unpredictably, so polyester liners are preferred for tight-tolerance parts. Adhesive squeeze-out at cut edges is controlled by maintaining die-cutting temperature below 40 °C and by using sharpened carbide blades replaced according to die-mileage logs.
The table below lists representative values for DFM0812-A conductive fabric tape and the test designations used for batch release. Values are class-representative and are not a substitute for the supplier lot certificate.
| Property | Test method | Typical value | Unit |
|---|---|---|---|
| Total thickness | ISO 4593:2019 | 0.080 ± 0.010 | mm |
| Width tolerance | Supplier optical measurement | 12 ± 0.5 | mm |
| Surface resistance, fabric face | ASTM D4496-21 | ≤0.05 | Ω/sq |
| Through-thickness resistance | MIL-STD-202 Method 307 | ≤0.03 | Ω |
| 180° peel adhesion, 20 min dwell | ASTM D3330 / PSTC 101 | 0.8–1.2 | N/mm |
| Shielding effectiveness, 30 MHz–1.5 GHz | ASTM D4935-18 | 60–85 | dB |
| Service temperature | Supplier thermal aging | -30 to +85 | °C |
| Surface resistance after 500 h at 85 °C/85% RH | Supplier accelerated aging | ≤0.10 | Ω/sq |
Shielding effectiveness for a die-cut DFM0812-A label is measured with a coaxial fixture according to ASTM D4935-18 using a reference specimen of 133 mm outer diameter and a test aperture of 76 mm. Values above 60 dB are typical in the 30 MHz–1.5 GHz band, but installation shielding depends on seam coverage, overlap length, and substrate conductivity. For cable wrapping, a 50% spiral overlap is the minimum for continuous shielding; gaps between wraps expose the underlying cable insulation and can create slot-antenna leakage. The adhesive is conductive, but it is not a structural bond; mechanical fastening or cable ties are required when the tape is used on cables that move or vibrate.
DFM0812-A is selected for thin dynamic seams rather than for soldered grounding planes or wide compressible gaps. Copper foil tape offers solderability and a continuous metallic barrier, but the foil alone has low flex fatigue resistance and can tear during repeated bending. DFM0812-A uses a woven fabric carrier that survives repeated flexing better than copper foil and also provides a degree of conformability over non-planar features. Compared with conductive foam gaskets, DFM0812-A is not intended to fill gaps greater than 0.25 mm; conductive foam provides higher compression set recovery and larger deflection ranges, but requires a wider bonding area and may generate debris during compression. The DFM0812-A adhesive is conductive and therefore supplies z-axis grounding without a separate tail, while a non-conductive adhesive fabric tape would electrically isolate the fabric from the mating surface. The DFM0812-A should not be used as a soldered ground strap or as a high-current power return path.
Conductive aluminum foil tape is lower in cost but forms aluminum oxide at the adhesive-metal interface and is not recommended when galvanic contact with copper is required. Copper foil tape with a conductive adhesive can be soldered and has higher current-carrying capacity, but under repeated flex it develops cracks; DFM0812-A is selected when the bondline must remain intact through hinge flexing or cable movement. Amorphous or nanocrystalline ribbon tapes provide high magnetic shielding but are not electrical seam shields; they address a different coupling mode and should not be compared on surface resistance alone.
In cable-wrap applications on production lines, a spiral wrapping machine is set to maintain 50% overlap and a wrap tension below 5 N. Excessive tension compresses the fabric and reduces shield coverage at the edge, while insufficient tension creates air gaps that degrade insertion loss at frequencies above 1 GHz. The tape should not be applied over silicone-coated or heavily plasticized wire jackets because the conductive adhesive can lose bond strength below 0.5 N/mm after plasticizer migration. In automotive harness prototypes, DFM0812-A is used for temporary shielding evaluations but must be protected from abrasion using an outer jacket or split tube. Published data for long-term dynamic flex cycling of DFM0812-A in engine-compartment harnesses is limited; designs that require continuous flexure above 10,000 cycles should be validated on the actual harness bundle.
DFM0812-A is not specified for permanently exposed outdoor use. Ultraviolet radiation and condensing moisture can oxidize the nickel-copper-nickel coating and increase surface resistance above 0.10 Ω/sq. If the tape is used in a telecommunication enclosure that is installed outdoors, the housing must provide UV shielding and water ingress protection. In high-humidity condensing environments above 85% relative humidity, moisture can become trapped under the tape and promote galvanic corrosion at the interface between the conductive adhesive and aluminum substrates; a chromate or polymer coating is required on the metal surface to prevent delamination. Direct contact with stainless steel is generally passivated and stable, but contact with bare magnesium or zinc-plated steel may require an additional corrosion inhibitor.
Thermal cycling between -30 °C and 85 °C for 500 h does not typically increase surface resistance above 0.10 Ω/sq, but the crosslinked acrylic adhesive may stiffen below -20 °C. In cold-weather assembly, rolls are conditioned at 23 °C before slitting to prevent brittle liner cracking and adhesive chipping. At temperatures above 85 °C, the conductive fabric does not melt, but the adhesive may lose peel strength and allow edge lift. Solder rework adjacent to the tape should not exceed 150 °C for more than 10 s because the fabric carrier can shrink and the acrylic adhesive can carbonate when exposed to hot-air or infrared soldering tools.
A compliance matrix for DFM0812-A is summarized below. The manufacturer’s lot certificate should be requested for each production batch, and the grade is normally supplied with RoHS 2011/65/EU Annex II and REACH SVHC declarations. Halogen-free status is available only where explicitly stated; standard conductive fabric tapes may contain halogenated flame retardants. The flammability rating of the tape is generally UL 94 V-0 for the 0.08 mm carrier when tested as a free film, but the final assembly rating depends on the substrate and adhesive combination.
| Requirement | Test or criterion | Status |
|---|---|---|
| RoHS 2011/65/EU Annex II | XRF screening for Pb, Hg, Cd, Cr(VI), PBB, PBDE | Pass |
| REACH SVHC | Declaration below 0.1% w/w per article | Pass |
| Halogen-free | IEC 61249-2-21 | Optional, confirm grade |
| Flammability | UL 94 | V-0 for 0.08 mm carrier |
| Packaging | EU Packaging Directive 94/62/EC | Supplier declaration |
Incoming inspection should measure thickness, width, surface resistance, and 180° peel adhesion on each lot. Thickness is measured with a flat anvil micrometer at five points across the roll width to ±0.010 mm. Width is checked against the ordered dimension with a tolerance of ±0.5 mm. Surface resistance is measured on the fabric face with a four-point probe according to ASTM D4496-21; values above 0.05 Ω/sq trigger quarantine. Peel adhesion is tested on a stainless-steel panel after 20 min dwell using ASTM D3330 / PSTC 101; the acceptance threshold is 0.8 N/mm. After 24 h, peel values may increase because of adhesive wet-out, and the supplier’s build curve should be used to distinguish normal development from adhesive or substrate failure. Incoming rolls that have been stored outside the recommended -10 °C to +40 °C range are conditioned at 23 ± 2 °C and 50 ± 10% relative humidity for 24 h before testing.
