| HS Code | 337931 |
| Manufacturer | Sichuan EM Technology |
| Product Code | DFM0819-A |
As an accredited Sichuan EM Technology DFM0819-A factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Sichuan EM Technology DFM0819-A epoxy molding compound is packaged as 20 kg per vacuum-sealed, moisture-proof aluminum bag with desiccant. |
| Container Loading (20′ FCL) | 20' FCL container loading of Sichuan EM Technology DFM0819-A chemical, ensuring safe, secure stowage and proper labeling for transport. |
| Shipping | For Sichuan EM Technology DFM0819-A (epoxy resin product), typical shipping description: UN 3082, Environmentally hazardous substance, liquid, n.o.s. (contains epoxy resin), Hazard Class 9, Packing Group III. Ensure proper labeling, approved drums/IBCs, segregation from food, and spill containment per the SDS. |
| Storage | Store Sichuan EM Technology DFM0819-A in a cool, dry, well-ventilated area, away from direct sunlight, heat, and ignition sources. Keep the container tightly sealed in its original packaging, protected from moisture and incompatible materials. Maintain stable temperatures between 5–35°C, avoid spills, and ensure proper labeling and access control. Follow local regulations and SDS guidance. |
| Shelf Life | Shelf life is 12 months from manufacture when stored unopened in original container under cool, dry conditions. |
DFM0819-A (10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, CAS 99208-50-1) is a halogen-free phosphorus-containing reactive flame retardant monomer supplied as an off-white to white powder. Lot-controlled inbound parameters include theoretical phosphorus content 9.56 wt%, hydroxyl equivalent weight 162 g/eq, HPLC purity ≥99.5%, melting range 247–251°C, and residual moisture ≤0.20 wt% by Karl Fischer titration after storage in sealed 25 kg fibre drums at 25°C. The bifunctional phenolic structure reacts with epoxy oxirane groups and therefore requires stoichiometric correction when added to dicyandiamide, phenolic novolac, anhydride, or benzoxazine cure systems. Unless otherwise stated, phr loads below refer to resin solids without solvent. Material exposed to ambient relative humidity above 60% should be tray-dried at 80°C for 4 h before batching because absorbed moisture shifts hydroxyl equivalent weight and shortens B-stage gel time on continuous prepreg treaters.
| Requirement | Standard or directive | Measurement or limit |
|---|---|---|
| Bromine content | IEC 61249-2-21 | <900 ppm |
| Chlorine content | IEC 61249-2-21 | <900 ppm |
| Total bromine plus chlorine | IEC 61249-2-21 | <1500 ppm |
| Flame rating of formulated laminate | UL 94 | V-0 at 0.8–1.6 mm |
| Reactive monomer purity | Internal HPLC method | ≥99.5% |
| RoHS restricted brominated flame retardants | Directive 2011/65/EU Annex II | Not present |
The resin matrix is batched in a vacuum-capable planetary mixer with swept-wall blades at jacket temperature 25–35°C, sweep speed 35–60 rpm, and high-speed disperser speed 1,200–1,500 rpm for 20–40 min. A starting formulation comprises 100 phr bisphenol A diglycidyl ether resin with epoxide equivalent weight 187–190 g/eq, 30–45 phr DFM0819-A, 2.5–3.5 phr dicyandiamide, 0.05–0.15 phr 2-methylimidazole, 0.5–1.5 phr epoxy-functional silane coupling agent, and a methyl ethyl ketone/propylene glycol monomethyl ether solvent blend adjusted to 35–80 cP at 25°C; this yields a cured-resin phosphorus concentration of 2.1–2.9 wt%. Industry compliance for the laminate is assessed against IPC-4101E/126 for halogen-free FR-4, IEC 61249-2-21 for halogen content, UL 94 V-0 at 1.6 mm laminate thickness, and IPC-TM-650 2.4.24.1 for glass transition temperature. Production impregnation is carried out on vertical or horizontal glass-cloth treaters with staged drying at 120–190°C; the 160–175°C B-stage window is critical because the reactive phenolic hydroxyls accelerate gelation relative to dicyandiamide-only varnish, and varnish viscosity below 35 cP at 25°C causes edge resin starvation on 1.2 m wide 7628 glass cloth. Final product types include single-sided, double-sided, and multilayer printed circuit boards used in power supply circuits, automotive dashboard electronics, and industrial control backplanes.
Transfer molding of thin quad flat packages with leadframe gap heights of 100–150 μm imposes a narrower processing window than copper-clad laminate varnish. A reference epoxy molding compound uses 100 phr ortho-cresol novolac epoxy resin with epoxide equivalent weight 195–210 g/eq, 35–45 phr phenol aralkyl hardener with hydroxyl equivalent weight 170–180 g/eq, 15–25 phr DFM0819-A, 0.2–0.5 phr triphenylphosphine catalyst, 70–85 wt% fused silica filler on total compound, 1.0–2.5 phr epoxy silane coupling agent, and 0.2–0.5 phr carbon black; the unfilled resin fraction contains 0.9–1.5 wt% phosphorus. Compliance for the packaged device is evaluated by UL 94 V-0 at 0.8 mm compound thickness, IEC 60749-5 temperature cycling, JEDEC J-STD-020E moisture sensitivity classification, and REACH SVHC absence documentation under Regulation (EC) No 1907/2006. Downstream compounding uses a heated kneader at 90–110°C, followed by a two-roll mill at 90–100°C, sheet cooling, crushing, and preform pressing before transfer molding at 165–180°C with 120–180 s cure time and 70–120 cm spiral flow. Because DFM0819-A adds reactive phenolic hydroxyls, increasing its loading from 15 to 25 phr without reducing phenol aralkyl hardener shifts stoichiometry and shortens gel time at 175°C from approximately 240 s to 150 s in spiral flow measurements; transfer-grade formulations therefore lower triphenylphosphine by 0.05–0.10 phr to hold spiral flow above 70 cm. Final product types include SOIC, QFP, QFN, and BGA packages for consumer power management, automotive gate drivers, and industrial microcontrollers.
High-layer-count backplane laminates require peak press temperature of 210–230°C to achieve full cure and laminate glass transition temperature above 180°C when tested by IPC-TM-650 2.4.24.1. A high-Tg halogen-free formulation uses 100 phr bisphenol A novolac epoxy resin, 40–50 phr DFM0819-A, 1.5–2.5 phr dicyandiamide, 0.03–0.08 phr 2-phenylimidazole, and a dimethylformamide/acetone solvent blend; the cured resin matrix carries 2.4–3.1 wt% phosphorus. The laminate is specified under IPC-4101E/99 for high-Tg glass-reinforced epoxy performance, UL 94 V-0, and IEC 61249-2-21 halogen-free classification. During vacuum lamination, the cure ramp is controlled from 80°C to 220°C at 2.0–2.5°C/min under 2.8–3.5 MPa; if the resin melt viscosity falls below 1,000 Pa·s during the 150–180°C interval, resin starvation occurs at the platen edges of 24-in × 36-in panel bookings. End products include server motherboards, telecom switching backplanes, and high-density interconnect base boards requiring sequential lamination.
Roll-to-roll coating of 25 μm polyimide carrier films with a no-flow flame-retardant epoxy adhesive containing DFM0819-A provides HDI fabricators a halogen-free bondply that fills blind microvias without resin starvation during vacuum lamination. The bondply matrix is batched at 35–45 wt% solids in methyl ethyl ketone with 100 phr bisphenol A epoxy resin, 30–35 phr DFM0819-A, 2.0–3.0 phr latent hardener, 0.2–0.5 phr fumed silica thixotrope, and 15–20 phr carboxyl-terminated butadiene acrylonitrile rubber for microcrack resistance; the phosphorus load in the resin fraction is 1.9–2.2 wt%. Compliance is evaluated against IPC-4204A for flexible metal-clad laminate adhesive systems, UL 94 VTM-0 for thin film flammability, and IPC-6012E for rigid-flex board quality. The coated adhesive is dried through 5–8 m ovens at 70–95°C to residual solvent below 0.15 wt%; solvent retention above this threshold creates microvoids during vacuum lamination at 190°C and 2.5–3.0 MPa for 90–120 min. Final product types include three-dimensional rigid-flex foldable smartphone interconnects, automotive camera module flex boards, and industrial rigid-flex control boards.
In anhydride-cured casting compounds for dry-type insulation, DFM0819-A is introduced at 10–18 phr into 100 phr bisphenol A/F epoxy resin with methylhexahydrophthalic anhydride at 85–95 phr and benzyldimethylamine accelerator at 0.1–0.3 phr. The phenolic hydroxyls participate in epoxy-anhydride chain propagation, and complete dissolution at 80–90°C is required before addition of 50–65 wt% silane-treated fused silica filler; the unfilled resin fraction contains 0.5–0.8 wt% phosphorus. Compliance for the finished insulation system is assigned through IEC 60455-2 for resin systems in electrical insulation, UL 1446 insulation system thermal class, and IEC 60695-2-11 glow-wire flammability at 960°C. The downstream process is vacuum casting into preheated moulds at 65–75°C, gelation at 100–120°C for 2–4 h, and post-cure at 130–150°C for 6–10 h; vacuum degassing longer than 30 min after filler addition increases filler sedimentation in low-viscosity batches. Published data for this specific anhydride-cured configuration is limited; laboratory screening under IEC 60455-2 thermal ageing is required before production qualification. Final product types include dry-type transformer winding spacers, switchgear bus support insulators, and cast-resin instrument transformer bodies.
| Application scenario | Resin basis | DFM0819-A loading | Phosphorus in resin fraction |
|---|---|---|---|
| Halogen-free FR-4 prepreg | Bisphenol A epoxy solids | 30–45 phr | 2.1–2.9 wt% |
| Epoxy molding compound | OCN epoxy solids | 15–25 phr | 0.9–1.5 wt% |
| High-Tg server-grade laminate | Bisphenol A novolac epoxy solids | 40–50 phr | 2.4–3.1 wt% |
| No-flow bondply | Bisphenol A epoxy solids | 30–35 phr | 1.9–2.2 wt% |
| Anhydride-cured potting | Bisphenol A/F epoxy solids | 10–18 phr | 0.5–0.8 wt% |
| Benzoxazine prepreg | Benzoxazine resin solids | 20–30 phr | 1.6–2.2 wt% |
DFM0819-A functions as a phenolic monomer in solvent-borne benzoxazine prepreg matrices when the cured composite is required to meet UL 94 V-0 without brominated curatives. The reactive synthesis of a phosphorus-containing benzoxazine prepolymer is performed at 90–110°C using bisphenol F, formaldehyde, and aniline-derived benzoxazine precursors with DFM0819-A at 20–30 phr on resin solids; the resulting resin matrix contains 1.6–2.2 wt% phosphorus. Compliance is demonstrated against IEC 61249-2-21 halogen-free limits, IPC-4101E base-material requirements, and ASTM D7309-21a micro combustion calorimetry for heat release characterisation. Lamination and cure are conducted at 180–220°C; a stepped vent cycle is necessary because ring-opening condensation releases volatiles that otherwise create microvoids when the press exceeds 220°C too early. Final product types include low-flammability rail transit interior wall panels and aircraft interior composite panels where the halogen-free requirement is applied across the entire laminate system.
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Sichuan EM Technology DFM0819-A is a reactive organophosphorus diphenolic compound supplied as a white to off-white crystalline powder. The product is chemically identified as 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, CAS 99208-50-1. Its molecular formula is C18H13O4P, the molecular weight is 324.27 g mol⁻¹, and the theoretical phosphorus content is 9.55 wt%. The molecule carries two phenolic hydroxyl groups, corresponding to a theoretical hydroxyl value of 346 mg KOH g⁻¹. Because the compound behaves as a bisphenol-type aromatic diol, it can react into epoxy resin advancement and cure networks rather than remaining dispersed as an additive after cure.
The manufacturer designates the product as DFM0819-A. The grade is intended for halogen-free epoxy formulations in which phosphorus is incorporated at the polymer backbone. Unlike non-reactive flame-retardant powders, the diphenolic structure allows the material to participate in epoxy ring-opening, which alters crosslink architecture and restricts surface migration during thermal aging.
Relative to unmodified DOPO monomer, CAS 35948-25-5, DFM0819-A provides two phenolic –OH groups instead of a single reactive P–H group. DOPO monomer has a phosphorus content of 14.33 wt%, higher than DFM0819-A, but it is monofunctional and does not give the same difunctional phenolic advancement behavior. Relative to tetrabromobisphenol-A, CAS 79-94-7, DFM0819-A replaces 58.8 wt% bromine with 9.55 wt% phosphorus. The flame-retardant mechanism is condensed-phase char formation rather than gas-phase bromine radical quenching. This difference typically shifts comparative tracking index values measured to IEC 60112 higher for phosphorus-based varnishes than for brominated FR-4 laminates and reduces smoke obscuration under the same fire-test exposure. The phosphorus concentration in a cured resin is stoichiometrically managed: 20.9 wt% DFM0819-A on resin solids provides 2.0 wt% phosphorus in the final resin. The same target cannot be set with TBBPA because TBBPA contains no phosphorus.
| Parameter | Specification | Test method |
|---|---|---|
| Appearance | White to off-white crystalline powder | Visual inspection |
| Melting range | 246–252 °C | ASTM E794 |
| Phosphorus content | 9.3–9.7 wt% | ICP-OES after acid digestion |
| Hydroxyl value | 340–350 mg KOH g⁻¹ | ISO 4629-1 |
| Loss on drying | ≤ 0.5 wt% | ISO 3251 |
| Total halogen | ≤ 0.1 wt% | EN 14582 |
The narrow hydroxyl-value interval is relevant for maintaining epoxy/hardener stoichiometry. A hydroxyl value drift of ±5 mg KOH g⁻¹ changes the calculated epoxy-equivalent requirement by less than 1.5% in a 20 wt% loaded varnish. At 20 wt% DFM0819-A loading, the phenolic contribution is approximately 1.23 eq kg⁻¹ of total resin solids. This value is not negligible in a dicyandiamide-cured FR-4 formulation and must be included in the hardener stoichiometry before mixing. The melting range of 246–252 °C is above typical ambient storage and dry-blending temperatures but below the decomposition onset of many epoxy laminating resins. In prepreg operations the product is usually dissolved in a ketone or glycol ether solvent rather than melted into the resin directly.
For FR-4 copper-clad laminate evaluation, DFM0819-A is pre-dissolved in methyl ethyl ketone or propylene glycol monomethyl ether acetate at 60–70 °C and metered into a varnish containing epoxy resin, dicyandiamide, and 2-methylimidazole accelerator. The solution is coated onto 7628-style E-glass fabric and B-staged at 130–160 °C. At a varnish phosphorus concentration of 2.0–2.5 wt%, laminates pressed at 190 °C for 120–180 min have been reported in similar DOPO-HQ-based systems to reach UL 94 V-0 at 0.8 mm thickness. Published data for the exact DFM0819-A grade in this configuration is limited, so the cure schedule and catalyst level must be re-qualified for each resin-to-glass ratio. During varnish recirculation, crystal precipitation can occur if the solution cools below 50 °C. Such precipitation has been observed as a differential-pressure rise across 1 μm cartridge filters within 30–60 min, which forces line stoppage before prepreg coating.
The two phenolic –OH groups generate ether linkages during epoxy advancement, while the 9,10-dihydro-9-oxa-10-phosphaphenanthrene oxide ring remains as a pendant aromatic phosphorus heterocycle. The ring disrupts chain packing and increases varnish viscosity; the formulation must compensate by reducing filler loading or by increasing solvent level. Mechanical trade-offs are conventional for reactive phosphorus diols. In similar DOPO-HQ-containing laminates, glass transition temperatures measured by differential scanning calorimetry at 20 K min⁻¹ have been 5–15 °C lower than the non-flame-retardant control, depending on crosslink density and catalyst level. The exact Tg shift for DFM0819-A is batch and formulation specific. Because the phosphorus is covalently bound, migration during thermal aging at 85 °C and 85% relative humidity for 168 h is lower than that of additive phosphates or phosphinate salts, but published extraction data for DFM0819-A are not available for all hardener systems.
Phosphorus-containing epoxies based on DFM0819-A can show higher comparative tracking index than brominated TBBPA laminates. In qualification work on similar DOPO-HQ systems, CTI values measured to IEC 60112 were above 600 V at 2.0 wt% phosphorus; TBBPA-containing FR-4 typically falls in the 200–400 V range. These values are not intrinsic to the product alone and must be confirmed on the final layer stack. Moisture absorption is a known boundary: polar P–O and aromatic phosphinate groups can increase water uptake relative to brominated formulations. At 85 °C/85% RH for 168 h, DOPO-HQ-modified epoxy laminates have shown mass gains of 0.6–1.2 wt% in published studies; the DFM0819-A grade should be tested under the same conditions because fabric weight and filler content influence the result. The powder should be pre-dried when ambient relative humidity exceeds 60%. Recommended pre-drying is 80 °C for 4 h under vacuum before varnish mixing.
DFM0819-A is halogen-free: total bromine and chlorine are controlled at ≤ 0.1 wt% by EN 14582. This allows the product to be considered in resin systems seeking compliance with IEC 61249-2-21 halogen-free laminate definitions. The substance is subject to REACH registration; downstream users must verify that their use is included in the supplier’s registration and that Safety Data Sheet exposure scenarios are observed. No FDA 21 CFR clearance is available for the neat chemical as a food-contact material. Incompatibility exists with strong oxidizing agents and with alkaline ash contamination, which can lower the onset of exothermic decomposition. The product should not be blended with amine-based curatives in dry form because the heat of reaction can initiate localized cure and create hard particles. The solid should be stored in sealed, moisture-barrier packaging at 15–30 °C. Under these conditions, re-testing of hydroxyl value and moisture content at 12-month intervals is common; significant decomposition is not expected at ambient storage for periods of 12–24 months if the desiccant is intact and the container remains sealed.
