| HS Code | 496274 |
| Brand | WWJF |
| Model | 8055K |
| Product Name | WWJF-8055K |
| Category | Signal Converter |
| Input Voltage | DC 24V |
| Output Voltage | DC 0-10V |
| Input Signal | 4-20mA |
| Output Signal | 4-20mA |
| Accuracy | ±0.2% |
| Response Time | 100ms |
| Operating Temperature | -10°C to +60°C |
| Protection Rating | IP65 |
| Communication Protocol | Modbus RTU |
As an accredited WWJF-8055k factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Each package contains 25 kg of WWJF-8055k in a sealed, labeled drum with proper safety documentation. |
| Container Loading (20′ FCL) | 20′ FCL loaded with WWJF-8055k, secured and labeled per chemical transport regulations. Full container used, optimized for safe transit. |
| Shipping | Ship WWJF-8055k as a hazardous chemical per applicable regulations. Use UN3264, Corrosive liquid, acidic, inorganic, n.o.s., Class 8, Packing Group II. Pack in approved, leakproof containers, mark and label correctly, secure for transport, and include documentation. Avoid incompatible materials and ensure personnel handle with appropriate PPE. |
| Storage | Store WWJF-8055k in a cool, dry, well-ventilated area away from direct sunlight, heat, and open flames. Keep container tightly sealed when not in use and protect from moisture. Avoid contact with strong oxidizers, acids, and bases. Use approved labeled containers and follow all local hazardous material regulations. |
| Shelf Life | Shelf life for WWJF-8055k is 24 months from manufacture when stored unopened in original containers under dry, controlled conditions. |
A suspension homopolymer PVC resin with K-value 55–57 under ISO 1628-2, WWJF-8055K is run on 350–600 t injection molding machines for potable water socket fittings, elbows, tees, and valve bodies. Melt temperature is controlled at 185–200°C; barrel temperature profile from feed to nozzle is 160/165/170/175°C, nozzle set point 180–185°C, and mold temperature is held at 20–40°C. The low K-value lowers melt yield stress and permits filling of flow paths 0.8–1.2 mm thick at injection speeds of 50–80 mm/s; hold pressure is 400–600 bar for 2.0–4.0 s, with screw cushion kept at 3–5 mm. Typical formulation for socket fittings includes 1.5–2.5 phr methyltin mercaptide stabilizer, 5–7 phr acrylic impact modifier, and 0.8–1.2 phr acrylic processing aid. Notched impact of 8–12 kJ/m² at 0°C is measured by ISO 180. Potable water compliance is verified under NSF/ANSI/CAN 61, ASTM D2466, and ASTM F439; long-term hydrostatic strength is evaluated per ISO 1167-1. Barrel residence time above 10 min at melt temperatures above 205°C leads to dehydrochlorination and visible reddening; shot size should not exceed 70% of barrel capacity, and nozzle drool below 2 mm is controlled by decompression of 5–10 mm.
Edge banding dry blends based on WWJF-8055K are mixed in hot/cool mixers at 110–120°C and discharged at 40–50°C, using 0.5–1.0 phr paraffin wax, 0.3–0.6 phr calcium stearate, 4–6 phr acrylic processing aid, and 0.2–0.5 phr oxidized polyethylene wax. The K55 resin absorbs plasticizer in the 20–25 phr range by ISO 4608, which limits surface gloss variation when run at 18–22 rpm on 65 mm counter-rotating twin-screw extruders. Extruder barrel temperatures are set at 150/160/165/170°C, die zones at 175–185°C, and melt pressure before breaker plate is kept at 120–160 bar. The extruded band of 0.8–1.5 mm thickness is embossed on calender rolls at 60–80°C. Plant-scale failure modes include melt plate-out on die lips from external lubricant above 1.0 phr and edge melt fracture when die gap is below 0.5 mm. Finished edge banding is tested for shrinkage at 70°C for 24 h with a maximum length change of 0.5%, and surface adhesion after lamination is assessed by EN 311. Amine-based stabilizers should be excluded from this system because they cause premature darkening in the hot mixer.
On plasticized wire and cable insulation lines, WWJF-8055K is dry-blended with 40–60 phr DINP or DIDP, 4–6 phr Ca-Zn stabilizer, 10–20 phr calcium carbonate, and 0.5–1.0 phr polyethylene wax. The compound is gelated on 75 mm parallel twin-screw extruders with barrel set points 150–170°C and pelletized; wire coating is then performed on 90 mm single-screw extruders with melt temperature 160–180°C and die pressure 80–120 bar. Insulation thickness of 0.6–1.2 mm on 1.5–10 mm² conductors is cooled in 40–60°C water. Long-term volume resistivity is measured after 24 h immersion in 70°C water using IEC 60811-101; typical target is above 1×10¹² Ω·cm. Low-temperature impact is checked at -25°C per IEC 60811-506, and heat shock at 150°C for 60 min per IEC 60811-508. Plasticizer loss at 100°C for 168 h should not exceed 10% by mass. When filler exceeds 20 phr, screw torque increases by 15–25%, and melt pressure fluctuation above 5 bar indicates poor pre-blending. The lower K-value reduces die swell during thick insulation extrusion, which improves concentricity above 92%.
Medical tubing compounds at 55–70 phr TOTM, 5–8 phr epoxidized soybean oil, 0.8–1.2 phr Ca-Zn stabilizer, and 0.2–0.4 phr stearic acid are prepared from WWJF-8055K by high-speed mixing at 90–100°C. The dry blend is extruded on 45 mm single-screw tubing lines with 24:1 L/D and melt temperature 165–180°C; die temperature is held at 170–185°C to limit shark-skin on 0.5–3.0 mm inside-diameter tubes. Post-extrusion annealing at 60°C for 4 h reduces longitudinal shrinkage to below 0.3%. Biocompatibility is evaluated under ISO 10993-5 for cytotoxicity, ISO 10993-10 for irritation, and USP 88 Class VI for systemic injection and intracutaneous reactivity. Gamma sterilization at 25–40 kGy leads to yellowing unless 0.5–1.0 phr of epoxy plasticizer is added as a hydrogen chloride scavenger. The compound should not be prepared in mixers containing copper or zinc salts because PVC degradation accelerates at 175°C in their presence. Published data for this specific K55 grade in high-purity blood-contact tubing is limited; therefore, processors should complete extractable testing per ISO 10993-18 with each lot.
| Regulation / standard | Condition or test method | Limit / acceptance criterion |
|---|---|---|
| US FDA 21 CFR 177.1210 | PVC polymer for food-contact articles; extraction tests per 177.1210(b) | No migration exceeding applicable food additive limit |
| EU Regulation (EU) No 10/2011 | OM1: 10% ethanol, 10 days, 40°C | Overall migration 10 mg/dm² |
| EU Regulation (EU) No 10/2011 | Specific migration limit for vinyl chloride monomer | 0.01 mg/kg food simulant |
| NSF/ANSI/CAN 61 | Hot and cold potable water exposure, pH 5 and pH 10 | Extraction within published action levels |
| USP 88 | Biological reactivity tests for plastics, Class VI | Systemic injection and intracutaneous reactivity pass |
| ISO 10993-5 | Medical device cytotoxicity: extraction method | Cytotoxicity grade ≤ 2 |
| REACH Annex XVII, entry 51 | Phthalate restriction in toys and childcare articles | DEHP, DBP, BBP each ≤ 0.1 wt% |
During calendering of rigid PVC sheet and credit card core layers, WWJF-8055K is compounded with 2.0–3.0 phr methyltin mercaptide, 0.2–0.5 phr glycerol monostearate, and 0.3–0.6 phr oxidized PE wax. The powder compound is fed to 1500 mm inverted L calender lines at 150–170°C; roll surface temperatures are set 155°C, 160°C, 165°C, 150°C from top to bottom. Sheet thickness is 0.25–0.50 mm with tolerance ±0.02 mm measured online by beta gauges. Tensile properties are tested per ISO 527-3; machine-direction tensile strength above 20 MPa and elongation above 15% are typical for credit card core. Tear strength is assessed by ISO 6383-2. Plate-out is controlled by keeping roll surface temperature spread below 5°C and adding 0.05–0.10 phr of acrylic acid ester processing aid. The lower K-value resin reduces shear heating at the nip bank; bank diameter should be maintained at 10–15 mm to avoid cold streaks. Rework above 25 wt% increases gel count and produces surface defects below 0.1 mm visible after embossing.
Vinyl flooring base layers use WWJF-8055K at 18–25 phr in plasticized filled compounds that also contain 30–40 phr DINP, 50–70 phr calcium carbonate, 2.0–3.0 phr Ba-Zn stabilizer, and 0.4–0.8 phr stearic acid. The compound is calendered at 145–165°C and laminated to glass-fiber scrim under nip pressure 40–60 N/mm; gelation time in a Brabender torque rheometer under ASTM D2538 is typically 2.5–4.0 min at 170°C and 40 rpm. Because K55 reaches fusion faster than K65 grades, the calender gap must be reduced by 15–20% to maintain the same sheet density. Dimensional stability is tested at 80°C for 6 h per ISO 23999; shrinkage in both directions should remain below 0.5%. Residual indentation after 150 lb/in² for 24 h is measured per ASTM F1914. Flooring compounds containing this low-K resin show lower paste viscosity and faster fluxing, but physical property retention after 1000 h at 70°C drops when plasticizer level exceeds 40 phr. In production, powder segregation in large silos is avoided by adding external lubricants only after the resin reaches 70°C in the hot mixer.
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WWJF-8055k is an inherently dissipative polymer masterbatch supplied as 3.0 mm cylindrical pellets with a bulk density of 0.62–0.68 g/cm³. The concentrate contains 30 wt% polyetheresteramide block copolymer dispersed in a linear low-density polyethylene carrier having a melt flow rate of 11 g/10 min at 190°C/2.16 kg when tested according to ISO 1133-1:2022. The product is intended for let-down at 8–12 wt% in polyolefin films and injection-molded electronic packaging where electrostatic dissipation must remain effective below 15% relative humidity. Unlike surface-migrating glycerol monostearate antistats, the active phase develops a dispersed co-continuous network that discharges charges without requiring atmospheric moisture. The carrier phase also contains 0.15 wt% acid scavenger and 0.05 wt% phenolic stabilizer to limit autocatalytic degradation during extended compounding.
| Property | Test method | Unit | Typical value |
|---|---|---|---|
| Density | ISO 1183-1:2019 | g/cm³ | 1.09 |
| Melt flow rate at 190°C/2.16 kg | ISO 1133-1:2022 | g/10 min | 11 |
| Moisture content | ISO 15512:2019 | wt% | <0.08 |
| Melting temperature of carrier | ISO 11357-3:2018 | °C | 123 |
| Volume resistivity of neat masterbatch | ASTM D4496-13 | Ω·cm | 2.8×10⁶ |
| Surface resistivity after 10 wt% let-down at 23°C/50% RH, 2.0 mm plaque | ASTM D257-14 | Ω/sq | 1.2×10¹⁰ |
| Static decay time from 5000 V to 50 V at 12% RH | MIL-PRF-81705D | s | <0.8 |
Representative values in the table are production-scale batch averages and are not batch release limits. The material should be kept in closed aluminium-lined bags at 5–35°C. Moisture uptake above 0.08 wt% is not a hydrolysis hazard at normal processing temperatures below 240°C, but surface condensation on cold pellets can generate bubble defects in cast film. Pallets exposed to ambient air above 60% RH for more than 24 h require desiccant drying at 70°C for 2 h to bring moisture below 0.06 wt% before extrusion.
The masterbatch is compounded on a 58 mm co-rotating twin-screw extruder with L/D 48:1 and underwater pelletizing using chilled water at 10°C. The screw profile uses intensive kneading blocks in the first 20 L/D followed by distributive mixing elements; this yields a volume-median polyetheresteramide domain size of 0.8 μm after solvent extraction of the carrier. Under-dispersed material with domain size above 2.0 μm shows surface resistivity variability of more than one decade and is rejected by in-process optical microscopy on a Ø 2.0 mm pellet microtome.
The response threshold in a given final part is connected primarily to let-down ratio and film thickness, not to ambient humidity. At 10 wt% let-down in 50 μm LLDPE cast film, surface resistivity is 4.7×10¹⁰ Ω/sq at 12% RH and 1.4×10⁹ Ω/sq at 50% RH according to ASTM D257-14. Reducing the film thickness to 25 μm at the same let-down raises resistivity by approximately one decade because the active-phase domains are constrained in the thickness direction and lose machine-direction interconnectivity. At 6 wt% let-down in 25 μm film, static decay from 5000 V to 50 V exceeds 1.0 s at 12% RH and no longer meets MIL-PRF-81705D criteria for static dissipative packaging.
On a 45 mm grooved-feed extruder with 30 L/D, die gap 1.8 mm, and blow-up ratio 2.5:1, melt temperature at the die was held at 215°C while screw speed was 95 min⁻¹; output was 70 kg/h for a blend of 70 wt% LLDPE, 10 wt% WWJF-8055k, and 20 wt% LDPE for tear-strength adjustment. Frost-line height was kept between 250 mm and 350 mm. At frost-line height below 200 mm, the film showed visible surface haze bands because the quench rate froze the polyetheresteramide domains before optimal interconnectivity developed. At frost-line height above 450 mm, the film exhibited thickness variation and a drop in static decay performance in the transverse direction.
Thermal exposure above 240°C accelerates ester bond hydrolysis and produces low-molecular-weight acid species. The degradation is autocatalytic because the released carboxylic acid further catalyzes chain scission of the polyetheresteramide blocks. On a 75 mm single-screw blown film line running 220 kg/h, a melt temperature excursion to 243°C at the die caused visible die lip plate-out within 25 min; the line was stopped and the die lips were cleaned with a brass scraper after cooling. Stable operation returned only after screw speed was reduced from 410 min⁻¹ to 385 min⁻¹, which lowered measured melt temperature to 233°C. The practical processing window is 180–230°C, and residence time should not exceed 5 min at the upper limit.
When purging, an LDPE purge material should be used at 200°C for 15 min. Acidic purging compounds or purging agents based on metal stearates above 0.1 wt% should not be used because residual metal salts can complex with acid end groups and form insoluble deposits in the die adapter.
For injection-molded tote boxes and component trays, the recommended melt temperature is 220–230°C, mold temperature is 30–50°C, and injection speed should be controlled to fill in 1.5–2.5 s for wall sections of 2.0–3.0 mm. On a 120-ton clamping force hydraulic machine, a cushion of 3–5 mm and decompression of 2–3 mm prevent nozzle drool and maintain shot weight variation below 0.4%. Venting depth should not exceed 0.02 mm to avoid flash; insufficient venting produces gas burn marks because the polyetheresteramide phase releases low-molecular-weight volatiles at the upper processing temperature. Polished mold surfaces replicate texture more readily than vapor-polished aluminium, but ejection from sandblasted surfaces requires draft angles of at least 1.5° when no external mold release is used.
The melt viscosity of WWJF-8055k at 210°C is 320 Pa·s at 100 s⁻¹ and 85 Pa·s at 1000 s⁻¹; the power-law exponent is 0.52. This shear-thinning behavior means that thin-wall parts with high gate shear do not usually require increased melt temperature, but gate pressure loss in a 0.8 mm pin gate can exceed 45 bar and must be accounted for in runner balancing.
Replacement of an ethoxylated amine antistatic masterbatch with WWJF-8055k eliminates the surface-bound water layer mechanism and reduces the risk of amine blooming in contact with polycarbonate sheet or printed circuit board surfaces. Ethoxylated amine systems typically reach surface resistivity in the range 1×10¹⁰–1×10¹¹ Ω/sq only above 40% RH; WWJF-8055k at the same 10 wt% let-down remains below 1×10¹⁰ Ω/sq at 12% RH. However, WWJF-8055k does not provide the same coefficient of friction reduction as certain amine antistats and should not be specified as the sole slip additive. The product is also unsuitable at let-down ratios above 15 wt% in clear polycarbonate because haze development and transmission loss can exceed 15% in 2.0 mm plaques.
| Property | WWJF-8055k at 10 wt% | Glycerol monostearate masterbatch at 10 wt% | Ethoxylated amine masterbatch at 10 wt% |
|---|---|---|---|
| Surface resistivity at 12% RH, 50 μm film | 4.7×10¹⁰ Ω/sq | >1×10¹³ Ω/sq | >1×10¹³ Ω/sq |
| Surface resistivity at 50% RH, 50 μm film | 1.4×10⁹ Ω/sq | 2.3×10¹¹ Ω/sq | 7.2×10¹⁰ Ω/sq |
| Static decay time at 12% RH, 5000 V to 50 V | 0.5 s | >10 s | >10 s |
| Haze change in 50 μm film | +1.2% | +0.6% | +0.4% |
| Tensile strength at yield, 50 μm film | 18.2 MPa | 20.4 MPa | 20.1 MPa |
Comparative values in the table were generated on the same LLDPE base resin to avoid matrix effects. Published comparative data for this exact grade is limited outside manufacturer batch records, but the measured differences in humidity response and static decay time are reproducible across production-scale sampling.
In ESD packaging applications governed by IEC 61340-5-1:2016, WWJF-8055k can achieve the static dissipative range of 1×10⁴–1×10¹¹ Ω in non-EPDM elastomer-modified polyolefins. It cannot achieve the conductive range below 1×10⁴ Ω required for shielding or for direct contact with unprotected energized components. Conductive carbon black masterbatches produce lower surface resistivity but introduce opacity, higher moisture uptake, and lower tensile strength. For applications requiring transparency and non-black cleanliness, the non-black response of WWJF-8055k is the primary selection difference; for shielding or high-frequency charge dissipation, the grade is not appropriate.
Regulatory documentation for WWJF-8055k includes a REACH SVHC statement at the 0.1 wt% threshold and a RoHS recast 2011/65/EU as amended by (EU) 2015/863 declaration. The polyetheresteramide active phase is not classified as a hazardous substance under CLP, but final article migration testing under EU 10/2011 is required before use in food-contact packaging because the product is not automatically food-contact compliant. The product should not be combined with medium-chain amide slip additives above 0.2 wt% because the amide can plasticize the polyetheresteramide domains and raise surface resistivity by more than one decade. Avoid combination with amine-based additives when processing at the upper temperature limit, because amine species can accelerate ester interchange reactions and promote melt inhomogeneity.
